Patents by Inventor James Boon Hua How

James Boon Hua How has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and machine for underfilling an assembly to form a semiconductor package
    Patent number: 6225144
    Abstract: A method and machine (1) for underfilling an assembly (8) to form semiconductor package is disclosed. The machine (1) has conveying tracks (2) for continuously conveying the assembly (8) past zones. The assembly (8) has a flexible tape substrate (9) with a mounted inverted semiconductor die (10). The machine includes a preheating zone (3), a dispensing zone (4) for dispensing an underfill material onto the substrate (9) whilst heating the assembly (8) to allow the underfill to flow into a gap between the substrate (9) and semiconductor die (10). The machine (1) also has a postheating zone (5) for postheating the assembly (8) after dispensing to provide for a continuous flow of the underfill into the gap.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: May 1, 2001
    Assignee: Motorola, Inc.
    Inventors: James Boon Hua How, Han Yang Chua, Peter Zhihua Yuan, Nee Seng Ling