Abstract: A semiconductor device architecture includes a silicon substrate having sidewalls that are passivated by encapsulating the sidewalls in dielectric materials having high electric field strength. Encapsulating all the sidewalls using high field strength dielectric materials eliminates electrical paths in air or vacuum and confines the electric fields in these high field strength materials, increasing the breakdown voltage relative to unencapsulated devices and allowing the device to withstand greater standoff voltages. In some cases, encapsulating the sidewalls in this manner can allow the device to withstand voltages of 500V or greater.

Abstract: A semiconductor device architecture includes a silicon substrate having sidewalls that are passivated by encapsulating the sidewalls in dielectric materials having high electric field strength. Encapsulating all the sidewalls using high field strength dielectric materials eliminates electrical paths in air or vacuum and confines the electric fields in these high field strength materials, increasing the breakdown voltage relative to unencapsulated devices and allowing the device to withstand greater standoff voltages. In some cases, encapsulating the sidewalls in this manner can allow the device to withstand voltages of 500V or greater.

Abstract: A transmit-received (TR) switch is designed such that the receiver-side shunt PIN diode acts as a switchable shunt diode while the switch operates in transmit mode and acts as a limiter while the switch operates in receive mode. This is achieved using a DC Schottky diode between the receiver-side shunt network and the biasing network. While the switch operates in receive mode, received radio frequency (RF) signals that exceed a power threshold cause the Schottky diode to become forward biased, causing the shunt PIN diode to act as a limiter that protects the receiver from excessively high RF signal power. This approach affords a high level of protection using a small number of components and without adding insertion loss to the RF signal path.

Abstract: A transmit-received (TR) switch is designed such that the receiver-side shunt PIN diode acts as a switchable shunt diode while the switch operates in transmit mode and acts as a limiter while the switch operates in receive mode. This is achieved using a DC Schottky diode between the receiver-side shunt network and the biasing network. While the switch operates in receive mode, received radio frequency (RF) signals that exceed a power threshold cause the Schottky diode to become forward biased, causing the shunt PIN diode to act as a limiter that protects the receiver from excessively high RF signal power. This approach affords a high level of protection using a small number of components and without adding insertion loss to the RF signal path.

Abstract: A semiconductor device architecture includes a silicon substrate having sidewalls that are passivated by encapsulating the sidewalls in dielectric materials having high electric field strength. Encapsulating all the sidewalls using high field strength dielectric materials eliminates electrical paths in air or vacuum and confines the electric fields in these high field strength materials, increasing the breakdown voltage relative to unencapsulated devices and allowing the device to withstand greater standoff voltages. In some cases, encapsulating the sidewalls in this manner can allow the device to withstand voltages of 500V or greater.

Abstract: A switching circuit includes a first diode coupled between a first terminal and a second terminal, a second diode coupled between the first terminal and a third terminal, and a bias circuit coupled to the first terminal and configured to bias the first diode on and the second diode off in a first switch state and to bias the first diode off and the second diode on in a second switch state, the bias circuit including a voltage converter configured to convert a fixed voltage to an intermediate voltage and a current source coupled in series with the voltage converter.

Abstract: A switching circuit includes a first diode coupled between a first terminal and a second terminal, a second diode coupled between the first terminal and a third terminal, and a bias circuit coupled to the first terminal and configured to bias the first diode on and the second diode off in a first switch state and to bias the first diode off and the second diode on in a second switch state, the bias circuit including a voltage converter configured to convert a fixed voltage to an intermediate voltage and a current source coupled in series with the voltage converter.

Abstract: A chip-scale package and method of manufacturing a chip-scale package are provided. The chip-scale package includes a mounting portion defined by a plurality of metal layers formed on each of a plurality of semiconductor regions for mounting a device thereto. The mounting portions are formed on a first side of the plurality of semiconductor regions. The chip-scale package further includes a backside metal surface formed on each of a second side of the plurality of semiconductor regions, with the plurality of semiconductor regions providing electrical connection between the mounting portions and the backside metal surfaces.

Abstract: A heterojunction P—I—N diode switch comprises a first layer of doped semiconductor material of a first doping type, a second layer of doped semiconductor material of a second doping type and a substrate on which is disposed the first and second layers. An intrinsic layer of semiconductor material is disposed between the first layer and second layer. The semiconductor material composition of at least one of the first layer and second layer is sufficiently different from that of the intrinsic layer so as to form a heterojunction therebetween, creating an energy barrier in which injected carriers from the junction are confined by the barrier, effectively reducing the series resistance within the I region of the P—I—N diode and the insertion loss relative to that of homojunction P—I—N diodes.