Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.

Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers.

Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

Abstract: A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

Abstract: A transparent self-sealing film suitable for packaging is made from a composition comprising (i) 90 to 99.95 wt. % of a copolymer of ethylene and a vinyl (or hydrocarbyl substituted vinyl) ester of a C.sub.1 -C.sub.30 monocarboxylic acid (vinyl acetate) containing at least 89 wt. % (e.g., 91 to 95 wt. %) of ethylene and (ii) either 0.05 to 10 wt. % of a hydrocarbon resin, or 0.05 to 5 wt. % of liquid polyisobutylene or liquid polybutylene (MW 30,000 to 50,000) or a combination of 0.05 to 10 wt. % of the hydrocarbon resin and 0.05 to 5 wt. % of polyisobutylene or polybutylene, provided the combined weight of hydrocarbon resin and polyisobutylene or polybutylene is not more than 10 wt. %.

Abstract: Compositions suitable for fabricating into a self-sealing film comprise (i) 90-99.95 wt.% of a copolymer of ethylene and a vinyl (or hydrocarbyl substituted vinyl) ester of a C.sub.1 -C.sub.30 monocarboxylic acid, (ii) either 0.05 to 10 wt.% of a hydrocarbon resin, or 0.05 to 5 wt.% of polybutylene or polyisobutylene, or a combination of 0.05 to 10 wt.% of the hydrocarbon resin and 0.05 to 5 wt.% of polybutylene or polyisobutylene, provided the combined weight of the hydrocarbon resin and polybutylene or polyisobutylene is not more than 10 wt.% and (iii) 0.01 to 3.0% by weight based on the combined weight of (i) and (ii) of a partial carboxylic acid ester of a polyol, e.g. sorbitan monolaurate.