Abstract: Decoding signals represented by a trellis of block length N divided into windows of length L includes a step of decoding a backward recursion from a point P that is after the end of a window back to the end of the window. P is chosen at a sufficient distance from the end of the window such that backward recursion determines a known state metric at the end of the window. A next step includes decoding the window using backward recursion from the known state at the end of the window back to the beginning of the window to define a set of known backward recursion state metrics which are stored. A next step includes decoding using forward recursion starting from a known state at the beginning of the window and moving forward. A next step includes calculating a soft output at each stage of the forward recursion using the stored backward recursion state metrics, and branch metrics at each stage, and outputting the soft output for that stage.

Abstract: The present invention is a system 10 for charging a plurality of remote computers that includes a plurality of switch members 12, each switch member 12 being connected to a predetermined quantity of remote computers via power lines 21 such that each switch member 12 has substantially the same quantity of remote computers connected thereto, a charge bank select member 13 for sequentially connecting each of the switch members 12 to a battery charger 18 such that the battery charger 18 simultaneously charges all remote computers connected to the switch member 12 that is connected to the battery charger 18, and a timer 20 that sets the time period that each switch member 12 is connected to the battery charger 18.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: The pulse-shaping look-up table with transient suppression (530) avoids hard turn-on and turn-off transients by modifying word segments of initial and final digital words during transmission of a digital data sequence. A controller (570) sends a mode signal and a digital data sequence to the pulse-shaping look-up table with transient suppression (530). A mode buffer and command block (560) uses the mode signal to control the creation of initial and final digital words created by a data buffer and control block (550) from the digital data sequence. The digital words are used by a look-up table (540) to create a sampled digital output waveform sequence. The pulse-shaping look-up table with transient suppression (530) provides an accurate output waveform sequence with reduced spectral emissions even during start-up and shut-down of digital data transmissions.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A radio communication device provides extended burst tone detection for a demodulated I and Q input signal. The device includes a first burst detector coupled with the input signal and provides a first detection signal when a FCB tone is detected. A frequency shifter is coupled with the input signal and frequency translates the input signal by a predetermined amount. A second burst detector is coupled with the translated input signal and provides a second detection signal when a FCB tone is detected. A combiner is coupled with the first and second detection signals and indicates FCB tone detection when either of the first and second detection signals indicate FCB tone detection.

Abstract: A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Abstract: A transient-suppressing mode switch (100) uses a state machine (120) in conjunction with a soft switch (114) to control a first mode signal sent from a first mode signal source (112) to a first soft switch input and a second mode signal from a second mode signal source (130) to a second soft switch input. When switching from a first mode to a second mode, the state machine delays the transition of the second mode signal from a constant zero value to a non-zero value until after the amplitude of the first mode signal at the first soft switch input has decayed to a sufficiently small value in order to reduce transients caused by switching.

Abstract: The pulse-shaping look-up table with transient suppression (530) avoids hard turn-on and turn-off transients by modifying word segments of initial and final digital words during transmission of a digital data sequence. A controller (570) sends a mode signal and a digital data sequence to the pulse-shaping look-up table with transient suppression (530). A mode buffer and command block (560) uses the mode signal to control the creation of initial and final digital words created by a data buffer and control block (550) from the digital data sequence. The digital words are used by a look-up table (540) to create a sampled digital output waveform sequence. The pulse-shaping look-up table with transient suppression (530) provides an accurate output waveform sequence with reduced spectral emissions even during start-up and shut-down of digital data transmissions.

Abstract: A coiled tubing hanger including a hanger bowl, a slip bowl supported in the hanger body, a plurality of slip segments disposed in the slip bowl so as to be movable between a retracted position wherein the tubular member is able to pass through the coiled tubing hanger and an extended position wherein a serrated surface of the slip segments engages the coiled tubing and forces the slip segments along the slip bowl so as to wedge the slip segments between the slip bowl and the coiled tubing to hold the coiled tubing.

Abstract: An apparatus and method for automated loading of a drilling machine package having a plurality of drill bit receiving openings arranged in a known configuration with verified precision drill bits from a drill bit container is disclosed. The apparatus includes an automated transfer machine which is connected to a control device, a package frame, a container receiving member, and a diameter sensing device. While not necessarily connected to the automated transfer machine, the package frame and the container receiving member are located at positions which are accessible by the automated transfer machine. Further, the diameter sensing device is operably associated with the automated transfer machine. The method of operation includes the control device recalling data specific to a particular job. A drill bit container is placed on the container receiving member.

Abstract: A method for fabricating a DMD spatial light modulator (10, 66) using an aluminum hard mask (40,50,80,90). The DMD superstructure (14,16) is comprised entirely of titanium tungsten (TiW), whereby the hinge (14) and beam (16) are patterned by a respective thin aluminum hard mask. A very rigid superstructure (14,16) is achieved, and the use of a sacrificial oxide hard mask is avoided. With the thin aluminum hard mask (40,80), good step coverage of subsequent layers is achieved. Relatively few semiconductor processing steps are required, with the titanium tungsten layers (32,44,72,84) being etched away with a fluorinated plasma. In one embodiment, the photoresist spacer layer (30) is never exposed to a fluorinated plasma.

Abstract: An improved support post (16, 23) for micro-mechanical devices (10). A conductive layer (33, 71) is deposited on a substrate at all places where the support posts (16, 23) are to be located. A spacer layer (41, 81) is then deposited and etched to form vias (41a, 81a). Each via (41a, 81a) defines the outer surface of a support post (16, 23). The bottom surface of each via is at the conductive layer (33, 71). This permits an aluminum CVD process to selectively fill the vias (41a, 81a), thereby forming the support posts (16, 23).

Abstract: A hybrid semiconductor device which comprises a semiconductor substrate having electrical devices therein with a plurality of spaced apart relatively rigid standoffs of electrically insulating material disposed over the substrate. Each of the standoffs has a substantially planar exposed surface remote from the substrate. A first layer of electrically insulating material more resilient than the standoffs is disposed over the substrate and between the standoffs and has an upper surface coplanar with the planar exposed surfaces of the standoffs. A semiconductor superstrate is secured to the first layer of electrically insulating material, the superstrate containing electrical devices. A connection connects the electrical devices contained in the superstrate to the electrical devices in the substrate.

Abstract: A method of fabricating micro-mechanical devices that use support elements (13) raised from a substrate (15), to support moveable elements (11). First, support elements (13) having reflective top surfaces (31) are fabricated. A layer of photoresist material (41) is then deposited over the support elements (13), to a thickness that substantially covers their reflective top surfaces (31). The photoresist layer (41) is exposed, which results in the areas (61) over the support elements (13) being more highly exposed than the areas (62) between the support elements (13). This permits a subsequent developing step that can be controlled to the purpose of removing the photoresist between the support elements (13) to a height planar with the reflective top surfaces of the support elements, while guaranteeing that the photoresist will be removed over the support elements (13).

Abstract: A method of making a hybrid semiconductor device and the device comprising providing a semiconductor substrate having electrical devices therein, providing a first resilient layer of electrically insulating material over the substrate which can be disposed directly onto the substrate with a substantially planar exposed surface, providing a second resilient layer of electrically insulating material over the first resilient layer which can be disposed directly onto the first layer with a substantially planar exposed surface, the second layer having a relatively resilient state and a rigid state, providing resilient standoff from the third resilient layer at spaced locations on the second layer by removing predetermined portions of the third layer, securing a semiconductor superstrate to the semiconductor device, forming electrical devices on the superstrate, and then connecting the electrical devices on the superstrate to the electrical devices on the substrate.

Abstract: In a communications device, two coherent detection algorithms (102 and 103), one of which has a decision feedback equalizer (103), and a detector selection algorithm (104) are used to dynamically select a detector depending on whether delay spread distortion is present. First the correlation of the detector without the equalizer (102) is measured. If this correlation is greater than a predetermined threshold, the data from that detector (102) is used by the communications device. If the correlation is less than the threshold, the correlation of the detector with the equalizer (103) is measured. If this is less than the correlation of the detector without the equalizer (102), the data from the detector without the equalizer (102) is used, otherwise the data is taken from the equalizer (103). In any case, if the detector without the equalizer is used, the detector with the equalizer is turned off.

Abstract: A method of fabricating a focal plane array having an integral slot shield which comprises fabricating a focal plane array having a plurality of detector elements. A layer of electrically insulating material, preferably a spun on epoxy, having a planar top surface is then formed over the array. A reflective layer is then formed over the layer of electrically insulating material and the electrically insulating layer and reflective layer are etched only in the regions thereof over the detector elements to form slots over said detector elements. The electrically insulating layer is etched with a directional etchant. The etched layer of electrically insulating material defines side walls in the slots, material from the side walls being removed to define non-planar sidewalls. The non-planar side walls preferably have an essentially sawtooth shape.

Abstract: The method of synchronizing a sampling clock signal to a received data signal, the clock recovery circuit generates several clock signals at the symbol rate, with each clock signal having a unique phase. To permit fast initial acquisition, the set of clock signals includes a pair of clocks which differ in phase by one-half of a symbol interval. Additionally, the clock recovery circuitry generates error signals representing the difference between the phase of the received data signal and the phase of each clock signal. The error signals are processed over multiple symbol times to determine the optimal sampling phase. The clock recovery circuit then adjusts or maintains the phase of the symbol clock to provide the optimal sampling phase.

Abstract: A method of making a hybrid semiconductor device and the device comprising providing a semiconductor substrate having electrical devices therein, providing a first resilient layer of electrically insulating material over the substrate which can be disposed directly onto the substrate with a substantially planar exposed surface, providing a second resilient layer of electrically insulating material over the first resilient layer which can be disposed directly onto the first layer with a substantially planar exposed surface, the second layer having a relatively resilient state and a rigid state, providing resilient standoff from the third resilient layer at spaced locations on the second layer by removing predetermined portions of the third layer, securing a semiconductor superstrate to the semiconductor device, forming electrical devices on the superstrate, and then connecting the electrical devices on the superstrate to the electrical devices on the substrate.