Patents by Inventor James C. Burnham

James C. Burnham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating seed layer buildup and repair
    Patent number: 11203816
    Abstract: Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty cycle of less than or about 50%. The methods may include plating a first amount of metal on a substrate within the plating bath. The substrate may define a via within the substrate. The methods may include, subsequent the first period of time, transitioning the power supply to a continuous DC current delivery for a second period of time. The methods may include plating a second amount of metal on the substrate.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: December 21, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Marvin L. Bernt, James C. Burnham, Robert Mikkola