Patents by Inventor James C. Golden

James C. Golden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attach stress isolation
    Patent number: 8803262
    Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: August 12, 2014
    Assignee: Rosemount Aerospace Inc.
    Inventors: Marcus A. Childress, Nghia T. Dinh, James C. Golden
  • DIE ATTACH STRESS ISOLATION
    Publication number: 20130181303
    Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 18, 2013
    Applicant: Rosemount Aerospace Inc.
    Inventors: Marcus A. Childress, Nghia T. Dinh, James C. Golden