Abstract: A device for individually testing semiconductor integrated circuits in wafer form at elevated and/or reduced temperatures include a fixture body for connection to a conventional probing device. The fixture body has an open-ended aperture to permit visual inspection of a circuit being tested, a plenum to receive pressurized gas at a selected temperature(s), and nozzles to direct the gas from the plenum into the aperture for ejection onto to the surface of the integrated circuit being tested to rapdily bring that circuit to the temperature of the gas.

Abstract: A device for individually testing semiconductor integrated circuits in wafer form at elevated and/or reduced temperatures include a fixture body for connection to a conventional probing device. The fixture body has an open-ended aperture to permit visual inspection of a circuit being tested, a plenum to receive pressurized gas at a selected temperature(s), and nozzles to direct the gas from the plenum into the aperture for ejection onto the surface of the integrated circuit being tested to rapidly bring that circuit to the temperature of the gas.