Patents by Inventor James C. Letterneau

James C. Letterneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device with stepped pads for connectivity
    Patent number: 8683870
    Abstract: A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: April 1, 2014
    Assignee: Meggitt (Orange County), Inc.
    Inventor: James C. Letterneau
  • Shock Resistant Mounting for High G Shock Accelerometer
    Publication number: 20120085170
    Abstract: A high-g shock accelerometer is provided with an LCC case. A MEMs acceleration sensor is positioned in an interior of the LCC case. The MEMs acceleration sensor has exterior surfaces including top and bottom surfaces and side surfaces. An elastomer is in an adjacent relationship or in contact to a majority of the exterior surfaces and to the interior of the LCC case. The MEMs acceleration sensor with the elastomer attenuates LCC case strain sensitivity while retaining wide band frequency response.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 12, 2012
    Inventor: James C. Letterneau