Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.

Abstract: An electronic light modulator device for at least partially displaying a pixel of an image, the device comprising first and second reflectors defining an optical cavity therebetween, the optical cavity being selective of an electromagnetic wavelength at an intensity by optical interference, the device having at least first and second optical states, at least one of the optical states being tunable and the other not tunable.

Abstract: Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed.

Abstract: A device including a substrate, a getter structure coupled to the substrate, and a photomask disposed over the getter structure. The photomask has a substantially transmissive and a substantially non-transmissive region. The substantially transmissive region substantially aligns with the getter structure.

Abstract: Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed

Abstract: Various embodiments of a MEMs structure including flexures movably supporting a reflective face are disclosed.

Abstract: An amplification apparatus is disclosed. The amplification apparatus includes a plurality of emitters formed on a first substrate, an anode formed adjacent to a second substrate, so that current can be conducted between the emitters of the first substrate and the anode of the second substrate. A lens is formed adjacent to the emitters for controlling a magnitude of the current, thereby providing amplification of a signal applied to the lens. An inter-substrate material connects the first substrate and the second substrate, forming a vacuum that includes the emitters, the anode and the lens. Either the first substrate or the second substrate includes solid state memory. An alternate embodiment includes a storage medium for receiving an electron beam from the electron emitter, the storage medium having a storage area, the storage area being in one of a plurality of states as determined by an electron beam generated by the electron emitter.

Abstract: A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.

Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.

Abstract: An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation condition. The deformation condition can be a predetermined pressure from opposing surfaces on the first and second substrates or it can be a predetermined combination of temperature and pressure from opposing surfaces on the first and second substrates.

Abstract: An ink jet cartridge is provided comprising an outlet port, an ink containing region, and a wick substantially surrounding a portion of the ink containing region, the wick being configured such that ink flows to the outlet port. Preferably, the wick is configured such that ink flows to the outlet port irrespective of an orientation of the ink jet cartridge.

Abstract: A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.

Abstract: A micro-fabricated device, includes a support structure and a device substrate disposed a distance G from the support structure. The micro-fabricated device further includes one or more thermally isolating structures that have a characteristic length, and the one or more thermally isolating structures is thermally coupled to the device substrate and the support structure. The characteristic length is greater than said distance G.

Abstract: An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation condition. The deformation condition can be a predetermined pressure from opposing surfaces on the first and second substrates or it can be a predetermined combination of temperature and pressure from opposing surfaces on the first and second substrates.

Abstract: An electronic device includes a non-evaporable getter material having a surface exposed to a low pressure and one or more circuit elements. The non-evaporable getter material forms at least a portion of the one or more circuit elements. The electronic device further includes one or more vacuum devices electrically coupled to the one or more circuit element.

Abstract: An ink jet cartridge is provided comprising an outlet port, an ink containing region, and a wick substantially surrounding a portion of the ink containing region, the wick being configured such that ink flows to the outlet port. Preferably, the wick is configured such that ink flows to the outlet port irrespective of an orientation of the ink jet cartridge.

Abstract: An electrical device has first and second substrates bonded together with a first material. Dispersed within the first material is a reducing agent for the diffusion therein of oxidation of a second material of which at least one of the first and second substrates is composed. The reducing agent has a higher affinity for oxygen than that of the second material.