Patents by Inventor James C. Reed, Jr.

James C. Reed, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for semiconductor wafer identification
    Patent number: 5864130
    Abstract: The apparatus (10) includes a batch wafer presentation system (12) receiving a cassette (14) carrying a plurality of wafers (16). The batch wafer presentation system (12) arranges the plurality of wafers (16) along an inclined presentation axis, .alpha., to simultaneously expose the bar code inscription on each wafer (16). A laser scanner (30) is mounted on an arm assembly (32) which travels long a track (34) parallel with the presentation axis. The laser scanner (30) is mounted such that its angular and spatial positions relative to the plurality of wafers (16) may be easily adjusted.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: January 26, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Randolph W. Kahn, James C. Reed, Jr.
  • Apparatus for semiconductor wafer identification
    Patent number: 5567927
    Abstract: The apparatus (10) includes a batch wafer presentation system (12) receiving a cassette (14) carrying a plurality of wafers (16). The batch wafer presentation system (12) arranges the plurality of wafers (16) along an inclined presentation axis, .alpha., to simultaneously expose the bar code inscription on each wafer (16). A laser scanner (30) is mounted on an arm assembly (32) which travels long a track (34) parallel with the presentation axis. The laser scanner (30) is mounted such that its angular and spatial positions relative to the plurality of wafers (16) may be easily adjusted.
    Type: Grant
    Filed: July 25, 1994
    Date of Patent: October 22, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: Randolph W. Kahn, James C. Reed, Jr.