Abstract: An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Abstract: A thermocouple temperature sensing device is disclosed for monitoring temperature at a plurality of selected locations along the length of an elongated conduit immersed within a heat conducting medium. The thermocouples, being progressive in length, are respectively attached to a common support rod by means of a thermal element. The thermal element is constructed to include an arcuate shaped strip of memory metal attached to the support rod and thermocouple by means of a C-shaped clip. As each thermal element reaches its transition temperature, its shape memory effect causes the thermal element to displace the thermocouple into forceable engagement with the inner wall of the conduit for monitoring the temperature thereat. As long as the thermal element is subjected to its transition temperature, there is a constant force being applied to the thermocouple.