Patents by Inventor James C. Van Zee

James C. Van Zee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of contacting a semiconductor die with probes
    Patent number: 5357192
    Abstract: A method of forming a contact between a semiconductor die (10) and a probe (36, 37, 38, 41, 42). The semiconductor die (10) has an integrated circuit region (11) and a bonding pad region (12). A conductive plane (31, 32) couples a bonding pad (16, 17) on one side of the semiconductor die (10) with a bonding pad (16, 17) on an opposite side of the semiconductor die (10). A first probe (41, 42) is positioned a first vertical distance above the conductive plane (31, 32) and a second probe is positioned a second vertical distance above the bonding pad (16, 17) on the semiconductor die (10). The second vertical distance is greater than the first vertical distance. Contacting a portion of the conductive plane (31, 32) with the first probe (41, 42) followed by contacting the bonding pad (16, 17) on the semiconductor die (10)with the second probe (36, 37). The diameter of the first probe (41, 42) is greater than that of the second probe (36, 37).
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: October 18, 1994
    Assignee: Motorola, Inc.
    Inventors: James C. Van Zee, Gregory L. Westbrook