Patents by Inventor James C. Wang

James C. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200398399
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 10766117
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: September 8, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20180185979
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 9937601
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: April 10, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20160045997
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: October 29, 2015
    Publication date: February 18, 2016
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 9186773
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: November 17, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 8963002
    Abstract: A foldable and restrainable cable for electrical and electronic devices. The cables are preformed with bends to allow the cable to be gathered together easier for bundling. The cable also has a restrainer section at one end to hold the cable together after it is gathered and bundled for storage.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: February 24, 2015
    Inventor: James C. Wang
  • Patent number: 8800066
    Abstract: The invention relates to fog-resistant goggles as well as to methods of defogging goggles during use and methods of producing fog-resistant goggles. Also included is a method and apparatus to direct airflow toward the lens and away from the eyes of an individual wearing the goggles.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: August 12, 2014
    Assignee: I.E. Manufacturing LLC
    Inventors: Bryan Hooper, James C. Wang
  • Publication number: 20140076626
    Abstract: A foldable and restrainable cable for electrical and electronic devices. The cables are preformed with bends to allow the cable to be gathered together easier for bundling. The cable also has a restrainer section at one end to hold the cable together after it is gathered and bundled for storage.
    Type: Application
    Filed: March 13, 2013
    Publication date: March 20, 2014
    Inventor: James C. WANG
  • Publication number: 20140053981
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: October 31, 2013
    Publication date: February 27, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Daniel Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20140030956
    Abstract: A polishing method includes positioning two substrates in contact with the same polishing pad. Prior to commencement of polishing and while the two substrates are in contact with the polishing pad, two starting values are generated from an in-situ monitoring system. Either a starting polishing time or a pressure applied to one of the substrates can be adjusted so that the two substrates have closer endpoint conditions. During polishing the two substrates are monitored with the in-situ monitoring system to generate a two sequences of values, and a polishing endpoint can be detected or an adjustment for a polishing parameter can be based on the two sequences of values.
    Type: Application
    Filed: July 25, 2012
    Publication date: January 30, 2014
    Inventors: Jimin Zhang, Jose Salas-Vernis, Ingemar Carlsson, David H. Mai, Huyen Tran, Zhihong Wang, Wen-Chiang Tu, Stephen Jew, Boguslaw A. Swedek, Shih-Haur Shen, James C. Wang, Yen-Chu Yang
  • Publication number: 20130319760
    Abstract: A foldable and restrainable cable for electrical and electronic devices. The cables are preformed with bends to allow the cable to be gathered together easier for bundling. The cable also has a restrainer section at one end to hold the cable together after it is gathered and bundled for storage.
    Type: Application
    Filed: September 20, 2012
    Publication date: December 5, 2013
    Inventor: James C. Wang
  • Patent number: 8585468
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: November 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20120276817
    Abstract: A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed.
    Type: Application
    Filed: April 27, 2011
    Publication date: November 1, 2012
    Inventors: Hassan G. Iravani, Kun Xu, Boguslaw A. Swedek, Ingemar Carlsson, Shih-Haur Shen, Wen-Chiang Tu, David Maxwell Gage, James C. Wang
  • Patent number: 8149866
    Abstract: A system and method and method for filtering communications at a network interface controller is provided. The network interface controller is coupled to a baseboard management controller through a sideband communications channel. The network interface controller filters packets to the baseboard management controller on the basis of the address within the packet that identifies the device that caused the packet to be generated. The network interface controller transmits to the baseboard management controller only those packets that were generated in response to a command issued by the baseboard management controller.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: April 3, 2012
    Assignee: Dell Products L.P.
    Inventors: Elie A. Jreij, Darrell L. Chieng, Stephen D. Cochran, Nasiha Hrustemovic, James C. Wang
  • Publication number: 20120071067
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: November 28, 2011
    Publication date: March 22, 2012
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 8066551
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: November 29, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20110195639
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: April 18, 2011
    Publication date: August 11, 2011
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 7927190
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: April 19, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 7815495
    Abstract: A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: October 19, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Jimin Zhang, James C. Wang, Thomas H. Osterheld, Yutao Ma, Steven M. Zuniga, Jin Yi