Patents by Inventor James Carducci

James Carducci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12191118
    Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
    Type: Grant
    Filed: January 22, 2024
    Date of Patent: January 7, 2025
    Assignee: Applied Materials, Inc.
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Vladimir Knyazik, Philip Allan Kraus, Thai Cheng Chua
  • Patent number: 12144090
    Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: November 12, 2024
    Assignee: Applied Materials, Inc.
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
  • Patent number: 12033835
    Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: July 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Philip Allan Kraus, Robert Moore, James Carducci, Richard Fovell, Sathya Swaroop Ganta, Karthikeyan Balaraman, Silverst Rodrigues
  • Publication number: 20240186118
    Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
    Type: Application
    Filed: January 22, 2024
    Publication date: June 6, 2024
    Inventors: JAMES CARDUCCI, RICHARD C. FOVELL, LARRY D. ELIZAGA, SILVERST RODRIGUES, VLADIMIR KNYAZIK, PHILIP ALLAN KRAUS, THAI CHENG CHUA
  • Patent number: 11881384
    Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Vladimir Knyazik, Philip Allan Kraus, Thai Cheng Chua
  • Patent number: 11670489
    Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: June 6, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
  • Publication number: 20230135935
    Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 4, 2023
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
  • Patent number: 11564292
    Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 24, 2023
    Assignee: Applied Materials, Inc.
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
  • Publication number: 20220051910
    Abstract: Gas distribution modules comprising a housing with an upper plenum and a lower plenum are described. One of the upper plenum and lower plenum is in fluid communication with an inlet and the other is in fluid communication with an outlet. A plurality of upper passages connects the upper plenum to the bottom of the housing to allow a flow of gas to pass through and be isolated from the first plenum.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Kallol Bera, Shahid Rauf, James Carducci, Vladimir Knyazik, Anantha K. Subramani
  • Publication number: 20210391149
    Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 16, 2021
    Inventors: Philip Allan Kraus, Robert Moore, James Carducci, Richard Fovell, Sathya Swaroop Ganta, Karthikeyan Balaraman, Silverst Rodrigues
  • Patent number: 11189502
    Abstract: Gas distribution modules comprising a housing with an upper plenum and a lower plenum are described. One of the upper plenum and lower plenum is in fluid communication with an inlet and the other is in fluid communication with an outlet. A plurality of upper passages connects the upper plenum to the bottom of the housing to allow a flow of gas to pass through and be isolated from the first plenum.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: November 30, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kallol Bera, Shahid Rauf, James Carducci, Vladimir Knyazik, Anantha K. Subramani
  • Publication number: 20210313153
    Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
    Type: Application
    Filed: June 17, 2021
    Publication date: October 7, 2021
    Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
  • Patent number: 11049694
    Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: June 29, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
  • Publication number: 20210098236
    Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
  • Publication number: 20210098231
    Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Vladimir Knyazik, Philip Allan Kraus, Thai Cheng Chua
  • Publication number: 20210100076
    Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
  • Publication number: 20190311920
    Abstract: Gas distribution modules comprising a housing with an upper plenum and a lower plenum are described. One of the upper plenum and lower plenum is in fluid communication with an inlet and the other is in fluid communication with an outlet. A plurality of upper passages connects the upper plenum to the bottom of the housing to allow a flow of gas to pass through and be isolated from the first plenum.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 10, 2019
    Inventors: Kallol Bera, Shahid Rauf, James Carducci, Vladimir Knyazik, Anantha K. Subramani
  • Patent number: 8080479
    Abstract: A method of processing a workpiece in a plasma reactor chamber includes coupling RF power via an electrode to plasma in the chamber, the RF power being of a variable frequency in a frequency range that includes a fundamental frequency f. The method also includes coupling the electrode to a resonator having a resonant VHF frequency F which is a harmonic of the fundamental frequency f, so as to produce VHF power at the harmonic. The method controls the ratio of power near the fundamental f to power at harmonic F, by controlling the proportion of power from the generator that is up-converted from f to F, so as to control plasma ion density distribution.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: December 20, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera, Lawrence Wong, Walter R. Merry, Matthew L. Miller, Steven C. Shannon, Andrew Nguyen, James P. Cruse, James Carducci, Troy S. Detrick, Subhash Deshmukh, Jennifer Y. Sun
  • Patent number: D687351
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: August 6, 2013
    Assignee: Carducci Dual Sport, LLC
    Inventors: James Carducci, Sherry Cordova
  • Patent number: D690237
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 24, 2013
    Assignee: Carducci Dual Sport, LLC
    Inventors: James Carducci, Sherry Cordova