Abstract: In described examples, a microelectromechanical system (MEMS) includes a first element and a second element. The first element is mounted on a substrate and has a first contact surface. The second element is mounted on the substrate and has a second contact surface that protrudes from the second element to form an acute contact surface. The first element and/or the second element is/are operable to move in: a first direction, such that the first contact surface comes in contact with the second contact surface; and a second direction, such that the second contact surface separates from the first contact surface.

Abstract: In described examples, a microelectromechanical system (MEMS) includes a first element and a second element. The first element is mounted on a substrate and has a first contact surface. The second element is mounted on the substrate and has a second contact surface that protrudes from the second element to form an acute contact surface. The first element and/or the second element is/are operable to move in: a first direction, such that the first contact surface comes in contact with the second contact surface; and a second direction, such that the second contact surface separates from the first contact surface.

Abstract: In described examples, a microelectromechanical system (MEMS) includes a first element and a second element. The first element is mounted on a substrate and has a first contact surface. The second element is mounted on the substrate and has a second contact surface that protrudes from the second element to form an acute contact surface. The first element and/or the second element is/are operable to move in: a first direction, such that the first contact surface comes in contact with the second contact surface; and a second direction, such that the second contact surface separates from the first contact surface.

Abstract: In described examples, a microelectromechanical system (MEMS) includes a first element and a second element. The first element is mounted on a substrate and has a first contact surface. The second element is mounted on the substrate and has a second contact surface that protrudes from the second element to form an acute contact surface. The first element and/or the second element is/are operable to move in: a first direction, such that the first contact surface comes in contact with the second contact surface; and a second direction, such that the second contact surface separates from the first contact surface.

Abstract: System and method for filling vias in integrated circuits A preferred embodiment comprises forming a spacer layer on a substrate, forming a via with walls and a bottom in the spacer layer, depositing a conformal conductive layer on the spacer layer and on the walls and bottom of the via, spinning-on a photo-definable material on the conductive layer, forming a fill layer on the conductive layer and filling the via, exposing portions of the fill layer to an exposing light using a photomask, developing the fill layer to remove select portions of the fill layer and leave a portion of the fill layer filling the via, and removing the spacer layer. The use of a spin-on photo-definable material increases the material's filling and planarizing capabilities, while enabling a reduction in the number of process steps, which may reduce the likelihood of manufacturing defects, thereby increasing manufacturing yield.

Abstract: System and method for filling vias in integrated circuits A preferred embodiment comprises forming a spacer layer on a substrate, forming a via with walls and a bottom in the spacer layer, depositing a conformal conductive layer on the spacer layer and on the walls and bottom of the via, spinning-on a photo-definable material on the conductive layer, forming a fill layer on the conductive layer and filling the via, exposing portions of the fill layer to an exposing light using a photomask, developing the fill layer to remove select portions of the fill layer and leave a portion of the fill layer filling the via, and removing the spacer layer. The use of a spin-on photo-definable material increases the material's filling and planarizing capabilities, while enabling a reduction in the number of process steps, which may reduce the likelihood of manufacturing defects, thereby increasing manufacturing yield.