Abstract: A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.

Abstract: A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.

Abstract: Metal interconnect layers on a top surface connected through holes to interconnect layers of the same or interconnect layers of a thermoelectrically different material on a bottom surface material on the bottom surface. Through hole connection provided by a material of the same or similar thermoelectric material as interconnects. A second metal of a thermoelectrically different material than the first interconnect layer is connected through a second hole from the top side interconnect to the bottom side interconnect. A second through hole connection provided by a metal of the same or similar thermoelectric material as the interconnect layer on the bottom side. Layers are connected in an alternating fashion to form a differential thermocouple. The pattern is created by printing conductive metallic inks on the surfaces and through holes, or by a combination of plating and etching processes and printing conductive metallic inks on the surfaces and through holes.

Abstract: A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.

Abstract: A method for chemical vapor deposition on a substrate is disclosed. The method may include directing a process gas into a reaction chamber, and heating the process gas in the reaction chamber. Heating the process gas in the reaction chamber may decompose the process gas to thereby generate a plurality of decomposition products. The method may also include applying one or more biasing fields and/or waves to the process gas upstream of the substrate, and reacting the process gas with the substrate. The one or more biasing fields and/or waves may include electromagnetic waves, electric fields, and/or magnetic fields. The biasing fields and/or waves may urge at least a portion of the process gas towards or away from the substrate.

Abstract: A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.

Abstract: A method for chemical vapor deposition on a substrate is disclosed. The method may include directing a process gas into a reaction chamber, and heating the process gas in the reaction chamber. Heating the process gas in the reaction chamber may decompose the process gas to thereby generate a plurality of decomposition products. The method may also include applying one or more biasing fields and/or waves to the process gas upstream of the substrate, and reacting the process gas with the substrate. The one or more biasing fields and/or waves may include electromagnetic waves, electric fields, and/or magnetic fields. The biasing fields and/or waves may urge at least a portion of the process gas towards or away from the substrate.

Abstract: There is provided a display device with an insert and an outer body. The insert preferably has a series of panels that are adapted to be folded and glued upon one another to form one or more chutes. The outer body preferably has a front panel, a rear panel, and a series of additional panels comprising a bottom panel, a foot panel, and a platform panel that are adapted to be folded upon themselves to collectively form a display base. The outer body may also have angled support legs or an angled bottom of the base that allow the body to lean back and support itself. In use, the insert can be inserted into the outer body and shipped in a flattened position. There is further provided a display base having a support grid, a face panel attached to the support grid, the face panel having one or more openings, one or more peg display hooks attached to the support grid through the one or more openings in the face panel, and one or more support legs. The display body may also have product pouches attached thereto.

Abstract: A low power IF strip architecture suitable for Zero-IF (ZIF) or low-IF (LIF) radio receivers for filtering and amplifying a received signal. The apparatus includes a plurality of sequentially connected complex filter/amplifier stages. Each stage includes a complex filter having one or more poles and an automatic gain controlled amplifier (AGC). Each AGC may be feedback or feedforward with fixed minimum and maximum gains. Each stage further includes a control circuit that produces a gain control signal for controlling the amplifier gain within the fixed minimum and maximum gains as a function of a projected amplitude level. The received signal passes through multiple stages of filtering and controlled amplification to attenuate the interfering signal and amplify the desired signal. This is done at a restricted level in each stage such that the circuits in the stages operate at efficient power saving levels.

Abstract: A display unit for displaying products in modules, the display unit formed from a single blank without the use of glue, tape or other fasteners, the shelves of which are preferably configured by passing a shelf panel in the back wall of the unit through an opening in the front wall of the display unit. The display unit, when assembled, comprises a front panel with a plurality of openings, side panels, and a back panel comprising shelf panels which extend through the openings of the front panel forming shelves. Modular product units may be placed on the shelves for product display. Each shelf may contain side walls, creating a friction fit with the product modules.

Abstract: Wireless communications devices must handle a wide range of useful signal levels and must also cope with large interfering signals of nearby frequencies. They often use transconductance amplifiers/filters as building blocks as such amplifier/filters exhibit good characteristics of both amplification and filtering. The transconductance cells described make use of feedbacks which involve no signal conversions. As the result, the cells have high linearity and yet can operate at low voltage.

Abstract: An alumina refractory material and its method of preparation are disclosed. The material includes a volatilized silica binder wherein the volatilized silica binder is added to the batch as a thoroughly dispersed, acidified, aqueous slurry. Graphite and silicon carbide may also be included to control erosion by molten metal. Green strength binders are also usually included.