Patents by Inventor James Chung Chang

James Chung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050047927
    Abstract: A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“?”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.
    Type: Application
    Filed: April 7, 2004
    Publication date: March 3, 2005
    Inventors: Chung Lee, Oanh Nguyen, Wei Lee, Michael Solomensky, Atul Kumar, James Chung Chang, Binh Nguyen