Abstract: An imaging device is provided that may be used for visually inspecting structures. In one embodiment, the imaging device includes an image capture device; and a rail system having a stationary component connected to the image capture device and a sliding component for movement along a horizontal axis. The system can further include a jig structure engaged to the sliding component of the rail system. The jig structure may include a first mount location for engagement to a first type connector and a second mount location for engagement to a second type connector. The jig structure is engaged to the sliding component to position the housing so that the first and second mount locations are in line and parallel to a direction of travel along the horizontal axis including a point at which the first and second mount locations pass through the imaging location.

Abstract: An imaging device is provided that may be used for visually inspecting structures. In one embodiment, the imaging device includes an image capture device; and a rail system having a stationary component connected to the image capture device and a sliding component for movement along a horizontal axis. The system can further include a jig structure engaged to the sliding component of the rail system. The jig structure may include a first mount location for engagement to a first type connector and a second mount location for engagement to a second type connector. The jig structure is engaged to the sliding component to position the housing so that the first and second mount locations are in line and parallel to a direction of travel along the horizontal axis including a point at which the first and second mount locations pass through the imaging location.

Abstract: An improved mask for screening a conductive paste onto a microelectronic substrate is disclosed. The mask comprises a metal foil having a thickness of less than about 200 microns, having a stencil formed in the foil and extending inwardly to a first depth from a first exterior surface of the foil, said stencil comprising a plurality of voids corresponding to the desired pattern, and having a mesh formed in the foil and extending inwardly to a second depth from a second exterior surface of the foil opposite said first exterior surface, said mesh comprising a plurality of voids in communication with the voids of the stencil, wherein the ratio of said first depth to said second depth is less than 60:40, and wherein the mask is produced from an essentially homogenous metal sheet. Such masks are useful for fabricating microelectronic substrates having screened lines of conductive paste.