Abstract: A hydroforming apparatus includes upper and lower platens that are connected together by tie rods extending through respective compression tubes. An upper die section is carried on the upper platen by a generally C-shaped suspension arm, while a lower die section is carried on the lower platen. The upper and lower die sections have recessed areas formed therein that define a die cavity. Lift assemblies are provided on the lateral ends of the hydroforming apparatus for selectively elevating the lower die section upwardly into engagement with the upper die section. When the lower die section is elevated by the lift assemblies, a workpiece is enclosed within the die cavity. A bolster is then moved between the hydroforming die and the lower platen. A cylinder array containing a plurality of pistons is next hydraulically actuated so as to securely clamp the hydroforming die between the cylinder array and the lower platen.

Abstract: A hydroforming apparatus includes upper and lower platens that are connected together by tie rods extending through respective compression tubes. An upper die section is carried on the upper platen by a generally C-shaped suspension arm, while a lower die section is carried on the lower platen. The upper and lower die sections have recessed areas formed therein that define a die cavity. Lift assemblies are provided on the lateral ends of the hydroforming apparatus for selectively elevating the lower die section upwardly into engagement with the upper die section. When the lower die section is elevated by the lift assemblies, a workpiece is enclosed within the die cavity. A bolster is then moved between the hydroforming die and the lower platen. A cylinder array containing a plurality of pistons is next hydraulically actuated so as to securely clamp the hydroforming die between the cylinder array and the lower platen.

Abstract: A chip carrier connector for mounting to a printed circuit board is disclosed. The connector includes a housing for supporting the chip carrier and a cover moveably supported thereover for retentively accommodating the chip carrier in the connector. The contacts of the connector are preformed to have a deflection bias to retentatively engage the leads of the chip carrier upon cam actuation of the contacts.