Patents by Inventor James Clayton Stice

James Clayton Stice has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
    Patent number: 6630360
    Abstract: A method is provided that comprises forming a copper seed layer on a workpiece and measuring the uniformity of the copper seed layer on the workpiece. The method further comprises applying the uniformity measurement to modify processing to form a copper layer having a desired uniformity profile for increased planarization in subsequent planarizing.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: October 7, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Craig William Christian, James Clayton Stice
  • Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
    Publication number: 20030129774
    Abstract: A method is provided that comprises forming a copper seed layer on a workpiece and measuring the uniformity of the copper seed layer on the workpiece. The method further comprises applying the uniformity measurement to modify processing to form a copper layer having a desired uniformity profile for increased planarization in subsequent planarizing.
    Type: Application
    Filed: January 10, 2002
    Publication date: July 10, 2003
    Inventors: Craig William Christian, James Clayton Stice
  • CMOS chemical bath purification
    Patent number: 6332973
    Abstract: CMOS processing is enhanced via a method and system that use a chemical bath purification process. According to an example embodiment of the present invention, solution from a CMOS wet chemical bath is passed over a powered circuit. The powered circuit plates out copper from the solution, and the solution is then returned to the bath. By removing copper from the chemical bath in this manner, cross-contamination of wet chemical equipment is reduced, and the need for redundant tool sets can be eliminated.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: December 25, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: James Clayton Stice