Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

Abstract: A semiconductor processing method capable of producing highly ordered, ultra thin dielectrics, including gate oxide and other semiconductor dielectrics, and interphase phases with low defect density. The process includes a degrease step, an etch, primary oxidation and then a passivation step which utilizes hydrofluoric acid to passivate the cleaned silicon surface with hydrogen. Dielectric layers may then be formed with low interface defect density, low flat band voltages and low fixed charge on semiconductor substrates.

Abstract: The present invention pertains to a fixture for terminating a miniature coaxial cable with a connector, and a kit for use with the fixture. The coaxial cable includes a center conductor and the connector has a connector center conductor which has a pin-shaped first end and a receiving member for receiving the central conductor of the coaxial cable. The fixture for terminating the coaxial table includes a base and a first beam and a second beam for holding the pin-shaped first end. The fixture also includes a third beam for holding the coaxial cable so that the center conductor of the coaxial cable can be inserted in the receiving member of the connector center conductor. The kit includes a working surface and a tray for holding parts of the connector.

Abstract: An electrical connector is disclosed having a housing extending from a first connection end to a second connection end. The first connection end is connectable to a BNC connector. The second connection end includes an RJ jack for receiving an RJ twisted pair plug. Internal circuitry is provided for connecting the coax connector end to the RJ connector end while providing desired impedance matching.

Abstract: The present invention is directed to connector apparatus comprising a jack (20) usable with either a conventional plug (400) terminating a coaxial cable (410) or a special plug (200) terminating a shielded, twisted pair cable (202). Such versatility was made possible by a full body first conductor (68) having spring contactors (130) which may be separated from grounding contact with barrel (36) of housing (32) by an insulator (216) of plug (200) includes a protruding insulator (216) for separating the contactors (130) and functioning the switching mechanism. Plug (200) also includes first and second conductors (212) and (214) for connection with second and first jack conductors (76) and (68), respectively. In addition, unique structures for pieceparts and assembly details resulting in various interlocking arrangements are disclosed with respect to the structure of jack (20) and plug (200).

Abstract: The present invention is directed to apparatus for maintaining good conductivity characteristics over time between a spring connector in contact with a connector housing having a plated substrate material. An insert is fitted into an appropriate space in the cast housing. The insert forms a gas tight seal with the housing at appropriate edges. The seal prevents oxidation of plating materials along the edges thereby maintaining good conductivity characteristics over time between the cast housing and the insert. The spring conductor and the insert are made from or plated with materials which do not form an oxide layer and thus maintain low contact resistance over time, thereby preserving good conductivity characteristics of the entire electrical path over time.

Abstract: The present invention is directed to connector apparatus comprising a jack (20) usable with either a conventional plug (400) terminating a coaxial cable (410) or a special plug (200) terminating a shielded, twisted pair cable (202). Such versatility was made possible by a full body first conductor (68) having spring contactors (130) which may be separated from grounding contact with barrel (36) of housing (32) by an insulator (216) of plug (200) includes a protruding insulator (216) for separating the contactors (130) and functioning the switching mechanism. Plug (200) also includes first and second conductors (212) and (214) for connection with second and first jack conductors (76) and (68), respectively. In addition, unique structures for pieceparts and assembly details resulting in various interlocking arrangements are disclosed with respect to the structure of jack (20) and plug (200).

Abstract: A dual density printed circuit board card cage for housing a plurality of printed circuit board cards in a parallel, stacked relationship. The card cage embodies a unique, intermediate frame member comprising a single piece of sheet metal having a plurality of openings and guide means on opposite sides of the intermediate frame member for mating with corresponding guide means on the upper and lower frame members. The guide means are comprised of a plurality of web portions each including a pair of guide edges extending upwardly and downwardly and in an alternating pattern.