Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component; wherein when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the draw rod.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electronic component and a cooling electrical component. Embodiments include a rotatable latch fastened to the heat generating electrical component, the rotatable latch including a hook; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages a pin extending from the cooling electrical component such that the thermal interface material adhered to the heat generating electrical component is coupled to the cooling component; when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the cooling electrical component; a load screw; wherein when the rotatable latch is in the engaged position, threading the load screw into the rotatable latch moves the rotatable latch into a locked state; and a spring leaf that is coupled to the heat generating electrical component.

Abstract: Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.

Abstract: Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.

Abstract: A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion.