Patents by Inventor James D. Hensley
James D. Hensley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10461450Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.Type: GrantFiled: July 24, 2017Date of Patent: October 29, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: James D. Hensley, David R. Cowles, David G. Rohrer
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Patent number: 10439307Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.Type: GrantFiled: July 26, 2017Date of Patent: October 8, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: James D. Hensley, David G. Rohrer, Brent A. Ford
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Patent number: 10418754Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.Type: GrantFiled: November 30, 2015Date of Patent: September 17, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
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Publication number: 20190036248Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.Type: ApplicationFiled: July 26, 2017Publication date: January 31, 2019Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
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Publication number: 20190027845Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.Type: ApplicationFiled: July 24, 2017Publication date: January 24, 2019Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
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Publication number: 20180358753Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.Type: ApplicationFiled: November 30, 2015Publication date: December 13, 2018Inventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
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Patent number: 9223325Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.Type: GrantFiled: October 27, 2011Date of Patent: December 29, 2015Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: James D. Hensley, Douglas E. O'Neil, Glenn C. Simon
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Publication number: 20140036451Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.Type: ApplicationFiled: July 31, 2012Publication date: February 6, 2014Inventors: Glenn C. Simon, David R. Cowles, James D. Hensley, Chadi Farid Theodossy, David G. Rohrer, Teri F. Greenhoe
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Patent number: 8614890Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.Type: GrantFiled: April 18, 2011Date of Patent: December 24, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: James D. Hensley, David G. Rohrer
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Patent number: 8608493Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.Type: GrantFiled: April 25, 2012Date of Patent: December 17, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: David R Cowles, Robert Dobbs, James D Hensley, John Machado
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Publication number: 20130288494Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Inventors: David R. Cowles, Robert Dobbs, James D. Hensley, John Machado
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Publication number: 20130110307Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.Type: ApplicationFiled: October 27, 2011Publication date: May 2, 2013Inventors: James D. Hensley, Douglas E. O'Neil, Glenn C. Simon
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Publication number: 20130074697Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.Type: ApplicationFiled: September 28, 2011Publication date: March 28, 2013Inventors: Teri F. Verschoor, Glenn C. Simon, James D. Hensley, David G. Rohrer
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Patent number: 8353718Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.Type: GrantFiled: December 17, 2010Date of Patent: January 15, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: James D. Hensley, David R. Cowles, David L. Mallery
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Publication number: 20120293968Abstract: Fasteners and fastening systems for holding an electronic card on a bulkhead are disclosed. An example of a fastener includes a pin on a first side of the bulkhead. The fastener also includes a bracket to hold a portion of the electronic card on the pin of the bulkhead. The fastener also includes a connector to hold the bracket on a second side of the bulkhead, the first side of the bulkhead substantially perpendicular to the second side of the bulkhead.Type: ApplicationFiled: May 16, 2011Publication date: November 22, 2012Inventor: James D. Hensley
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Publication number: 20120262876Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.Type: ApplicationFiled: April 18, 2011Publication date: October 18, 2012Inventors: James D. Hensley, David G. Rohrer
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Publication number: 20120156922Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.Type: ApplicationFiled: December 17, 2010Publication date: June 21, 2012Inventors: JAMES D. HENSLEY, David R. Cowles, David L. Mallery
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Patent number: 7539027Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.Type: GrantFiled: October 29, 2007Date of Patent: May 26, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena
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Publication number: 20080101016Abstract: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle bladder is fixedly couplable to a first interior surface of the computer system. The topologically self-adjusting compliant surface of the linearly inflating airflow baffle bladder is couplable to an internal topology of the computer system in response to inflation of said linearly inflating airflow baffle bladder.Type: ApplicationFiled: October 31, 2006Publication date: May 1, 2008Inventors: Michael Brooks, James D. Hensley, Stephan Barsun
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Patent number: 7289335Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.Type: GrantFiled: July 8, 2003Date of Patent: October 30, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena