Patents by Inventor James D. Hensley

James D. Hensley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10461450
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: October 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Patent number: 10439307
    Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 8, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
  • Patent number: 10418754
    Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: September 17, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
  • Publication number: 20190036248
    Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
    Type: Application
    Filed: July 26, 2017
    Publication date: January 31, 2019
    Inventors: James D. Hensley, David G. Rohrer, Brent A. Ford
  • Publication number: 20190027845
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Application
    Filed: July 24, 2017
    Publication date: January 24, 2019
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Publication number: 20180358753
    Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.
    Type: Application
    Filed: November 30, 2015
    Publication date: December 13, 2018
    Inventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
  • Patent number: 9223325
    Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: December 29, 2015
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: James D. Hensley, Douglas E. O'Neil, Glenn C. Simon
  • Publication number: 20140036451
    Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Inventors: Glenn C. Simon, David R. Cowles, James D. Hensley, Chadi Farid Theodossy, David G. Rohrer, Teri F. Greenhoe
  • Patent number: 8614890
    Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: December 24, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James D. Hensley, David G. Rohrer
  • Patent number: 8608493
    Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: December 17, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David R Cowles, Robert Dobbs, James D Hensley, John Machado
  • Publication number: 20130288494
    Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.
    Type: Application
    Filed: April 25, 2012
    Publication date: October 31, 2013
    Inventors: David R. Cowles, Robert Dobbs, James D. Hensley, John Machado
  • Publication number: 20130110307
    Abstract: Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 2, 2013
    Inventors: James D. Hensley, Douglas E. O'Neil, Glenn C. Simon
  • Publication number: 20130074697
    Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.
    Type: Application
    Filed: September 28, 2011
    Publication date: March 28, 2013
    Inventors: Teri F. Verschoor, Glenn C. Simon, James D. Hensley, David G. Rohrer
  • Patent number: 8353718
    Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: January 15, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James D. Hensley, David R. Cowles, David L. Mallery
  • Publication number: 20120293968
    Abstract: Fasteners and fastening systems for holding an electronic card on a bulkhead are disclosed. An example of a fastener includes a pin on a first side of the bulkhead. The fastener also includes a bracket to hold a portion of the electronic card on the pin of the bulkhead. The fastener also includes a connector to hold the bracket on a second side of the bulkhead, the first side of the bulkhead substantially perpendicular to the second side of the bulkhead.
    Type: Application
    Filed: May 16, 2011
    Publication date: November 22, 2012
    Inventor: James D. Hensley
  • Publication number: 20120262876
    Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 18, 2012
    Inventors: James D. Hensley, David G. Rohrer
  • Publication number: 20120156922
    Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: JAMES D. HENSLEY, David R. Cowles, David L. Mallery
  • Patent number: 7539027
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: May 26, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena
  • Publication number: 20080101016
    Abstract: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle bladder is fixedly couplable to a first interior surface of the computer system. The topologically self-adjusting compliant surface of the linearly inflating airflow baffle bladder is couplable to an internal topology of the computer system in response to inflation of said linearly inflating airflow baffle bladder.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 1, 2008
    Inventors: Michael Brooks, James D. Hensley, Stephan Barsun
  • Patent number: 7289335
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: October 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena