Abstract: Soldering techniques, where a circuit component having a row of closely spaced leads (e.g., dual in-line packages) are to be soldered to a printed circuit board and the leads are oriented on the printed circuit board such that the row of leads is arranged parallel to the direction of motion of the printed circuit board through a wave solder pot, may effect a high incidence of soldering bridging. This bridging may form between the last few adjacent leads in the row which emerges from the solder pot. A printed circuit board is provided with an additional foil pad (or a pair of additional pads in the case of a dual in-line package) arranged in line with the row of leads. This additional foil pad tends to draw off any excess solder to reduce the solder bridging between adjacent leads during the soldering operation.