Abstract: Methods and systems to control stacked hexapod platforms for use as tools, which function with both high accuracy and high precision are provided. In some embodiments, the methods and systems include a convergence of modern control theory, and machine learning. Furthermore, some embodiments provide control algorithms to carry out autonomous in-space assembly operations using assemblers. Some embodiments provide methods and systems which combine long-reach low precision manipulators and smaller, high-precision assembler with interchangeable tools.

Abstract: The present invention provides a method for manufacturing semiconductor devices, a method for manufacturing an integrated circuit, and a method for improving a drive current for semiconductor devices on a wafer-by-wafer basis. The method for manufacturing semiconductor devices, among other elements, includes patterning gate structures on a substrate (220), each of the gate structures having a profile associated therewith, and obtaining information representative of the profiles of the gate structures (240). In accordance with the present invention the information may then be fed forward to alter a manufacturing parameter associated with a drive current of the semiconductor devices (250).