Patents by Inventor James Daniel Bielick

James Daniel Bielick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
    Patent number: 5873512
    Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.
    Type: Grant
    Filed: April 25, 1997
    Date of Patent: February 23, 1999
    Assignee: International Business Machines Corporation
    Inventors: James Daniel Bielick, Mark Kenneth Hoffmeyer, Phillip Duane Isaacs, Thomas Donald Kidd, David Allen Sluzewski
  • Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
    Patent number: 5806753
    Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: September 15, 1998
    Assignee: International Business Machines Corporation
    Inventors: James Daniel Bielick, Mark Kenneth Hoffmeyer, Phillip Duane Isaacs, Thomas Donald Kidd, David Allen Sluzewski