Abstract: An electronic system, an apparatus for cooling an electronic system, an electronics cooling apparatus, and associated method use a clutch to operate a cooling fan. An electronics cooling fan for usage in cooling an electronic system comprises a clutch that disengages upon failure wherein the electronics cooling fan is configured to freewheel upon disengagement of the clutch.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved bolster plate. A third embodiment of the invention involves an assembled substrate with a pre-curved bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Abstract: A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.