Patents by Inventor James Deepak

James Deepak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive material compositions, apparatus, systems, and methods
    Publication number: 20050151233
    Abstract: Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78%-83% by weight of lead, about 9%-11% by weight of antimony, about 1%-3% by weight of silver, and a balance of tin. Some embodiments include a process of removing a previously-existing lead finish, and applying a new finish to the lead to improve solder operation compatibility, as well as solder joint reliability in high temperature environments.
    Type: Application
    Filed: March 31, 2004
    Publication date: July 14, 2005
    Inventors: James Deepak, Andrew Hrametz