Patents by Inventor James Derksen
James Derksen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6900562Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.Type: GrantFiled: April 6, 2004Date of Patent: May 31, 2005Assignee: Siemens Energy & Automation, Inc.Inventor: James Derksen
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Patent number: 6891725Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.Type: GrantFiled: September 23, 2002Date of Patent: May 10, 2005Assignee: Siemens Energy & Automation, Inc.Inventor: James Derksen
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Patent number: 6841747Abstract: Broadly, there is disclosed in accordance with a first aspect of the invention a reversible housing base for a motor controller having controllable switches of selectable size and bus bars having size selected according to switch size. The reversible housing base comprises a front wall, a rear wall and opposite side walls. The side walls are connected to the front and rear walls in a rectangular configuration to surround the switches and to define a top surface and an opposite bottom surface. The front and rear wall top surface each has a set of slots of a first size to support a first size of bus bars and the front and rear wall bottom surface each has a set of slots of a second size to support a second size of bus bars. The orientation of the housing base is reversible according to size of the bus bars.Type: GrantFiled: September 23, 2002Date of Patent: January 11, 2005Assignee: Siemens Energy & Automation, Inc.Inventors: James Derksen, Patrick Mo
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Publication number: 20040207344Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.Type: ApplicationFiled: April 6, 2004Publication date: October 21, 2004Applicant: Siemens Energy & Automation, Inc.Inventor: James Derksen
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Publication number: 20040056631Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.Type: ApplicationFiled: September 23, 2002Publication date: March 25, 2004Inventor: James Derksen
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Publication number: 20040055859Abstract: Broadly, there is disclosed in accordance with a first aspect of the invention a reversible housing base for a motor controller having controllable switches of selectable size and bus bars having size selected according to switch size. The reversible housing base comprises a front wall, a rear wall and opposite side walls. The side walls are connected to the front and rear walls in a rectangular configuration to surround the switches and to define a top surface and an opposite bottom surface. The front and rear wall top surface each has a set of slots of a first size to support a first size of bus bars and the front and rear wall bottom surface each has a set of slots of a second size to support a second size of bus bars. The orientation of the housing base is reversible according to size of the bus bars.Type: ApplicationFiled: September 23, 2002Publication date: March 25, 2004Inventors: James Derksen, Patrick Mo
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Publication number: 20010001746Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.Type: ApplicationFiled: December 20, 2000Publication date: May 24, 2001Inventors: Jung-Hoon Chun, James Derksen, Sangjun Han
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Patent number: 6191053Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.Type: GrantFiled: June 10, 1998Date of Patent: February 20, 2001Assignee: Silicon Valley Group, Inc.Inventors: Jung-Hoon Chun, James Derksen, Sangjun Han