Patents by Inventor James Devereaux Jarrett

James Devereaux Jarrett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of protecting read sensors from electrostatic discharge damage during the manufacture of magnetic heads
    Patent number: 6795278
    Abstract: Methods and apparatus for protecting read sensors from damage caused by electrostatic discharge (ESD) during manufacturing are described. Two electrical connections are formed and utilized for ESD protection: one primarily for early protection of the sensors (i.e. prior to cutting and lapping the wafer to form the ABS) and the other primarily for later protection of the sensors (i.e. after cutting and lapping the wafer to form the ABS). The first electrical connection is created between the read sensor and the first and second shields, and is severed when the wafer is cut and lapped along the ABS. The second electrical connection is formed between the sensor leads and the first and second shields, and is exposed on an outside surface of the magnetic head. The second electrical connection is severed late in the manufacturing process, preferably by laser-deletion.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: September 21, 2004
    Assignee: International Business Machines Corporation
    Inventors: James Devereaux Jarrett, Richard Hsiao, Ciaran Avram Fox, Edward Hin Pong Lee, Thomas Robert Albrecht
  • Method of protecting read sensors from electrostatic discharge damage during the manufacture of magnetic heads
    Publication number: 20030184920
    Abstract: Methods and apparatus for protecting read sensors from damage caused by electrostatic discharge (ESD) during manufacturing are described. Two electrical connections are formed and utilized for ESD protection: one primarily for early protection of the sensors (i.e. prior to cutting and lapping the wafer to form the ABS) and the other primarily for later protection of the sensors (i.e. after cutting and lapping the wafer to form the ABS). The first electrical connection is created between the read sensor and the first and second shields, and is severed when the wafer is cut and lapped along the ABS. The second electrical connection is formed between the sensor leads and the first and second shields, and is exposed on an outside surface of the magnetic head. The second electrical connection is severed late in the manufacturing process, preferably by laser-deletion.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 2, 2003
    Inventors: James Devereaux Jarrett, Richard Hsiao, Ciaran Avram Fox, Edward Hin Pong Lee, Thomas Robert Albrecht