Patents by Inventor James Donley

James Donley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and method
    Publication number: 20050121767
    Abstract: An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
    Type: Application
    Filed: January 24, 2005
    Publication date: June 9, 2005
    Inventors: Phillip Celaya, James Donley, Stephen St. Germain