Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A WDM optical system including a media converter module including a plurality of converter cards, each converter card being configured to convert a native signal into an optical signal. The system also includes a panel bracket having an opening and a plurality of fingers, and a cable management panel including a drawer having an interior space. The cable management panel includes a splitter/combiner module mounted in the interior space, and the cable management panel is positioned in the opening of the panel bracket so that a space is defined between the cable management panel and the media converter module.

Abstract: A WDM optical system including a media converter module including a plurality of converter cards, each converter card being configured to convert a native signal into an optical signal. The system also includes a panel bracket having an opening and a plurality of fingers, and a cable management panel including a drawer having an interior space. The cable management panel includes a splitter/combiner module mounted in the interior space, and the cable management panel is positioned in the opening of the panel bracket so that a space is defined between the cable management panel and the media converter module.

Abstract: A WDM optical system including a media converter module including a plurality of converter cards, each converter card being configured to convert a native signal into an optical signal. The system also includes a panel bracket having an opening and a plurality of fingers, and a cable management panel including a drawer having an interior space. The cable management panel includes a splitter/combiner module mounted in the interior space, and the cable management panel is positioned in the opening of the panel bracket so that a space is defined between the cable management panel and the media converter module.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A fiber optic adapter or adapter assembly including a pair of clip arms extending from opposite sides. The clip arms include an angled outer surface and sides of a housing of the adapter include opposing flanges, the clips arms and the flanges cooperating to releasably hold the adapter to a mounting location. The clip arms each including an angled outer surface which engages sides at the mounting location to hold the adapter at the mounting location. Pulling on a first end of the adapter to remove it from the mounting location causes the sides to engage the angled outer surface of the clip arms and permit the adapter to be removed from the mounting location toward the first end.

Abstract: A WDM optical system including a media converter module including a plurality of converter cards, each converter card being configured to convert a native signal into an optical signal. The system also includes a panel bracket having an opening and a plurality of fingers, and a cable management panel including a drawer having an interior space. The cable management panel includes a splitter/combiner module mounted in the interior space, and the cable management panel is positioned in the opening of the panel bracket so that a space is defined between the cable management panel and the media converter module.