Abstract: Devices, systems, and methods for non-invasively detecting and monitoring medical conditions using multiple modalities of sensing include at least two electrodes configured to be positioned on a subject, an acoustic sensor configured to be positioned on a subject, a thoracic impedance measurement module connected to the electrodes, for measuring a first impedance between the electrodes, and a heart acoustic measurement module connected to the acoustic sensor, for detecting and measuring a heart sound from the acoustic sensor.

Abstract: An inductive device may include a pair of half-shell magnetically-conductive housings joined together and defining an enclosed cavity between them. The inductive device may also include primary and secondary windings provided spatially within the cavity providing magnetic coupling between them. The windings may be electrically insulated from each other and terminals of the primary and secondary windings may traverse to an exterior of the inductive device.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: An inductive device may include a pair of half-shell magnetically-conductive housings joined together and defining an enclosed cavity between them. The inductive device may also include primary and secondary windings provided spatially within the cavity providing magnetic coupling between them. The windings may be electrically insulated from each other and terminals of the primary and secondary windings may traverse to an exterior of the inductive device.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.

Abstract: A microactuator is disclosed including one or more stationary plates formed on a substrate, a mirror base plate on which a mirror is formed, and one or more actuation plates coupled to the mirror base plate by one or more microspring mechanisms. The mirror base plate, the one or more actuation plates and the one or more microspring mechanisms are suspended over the stationary plates by one or more anchors. The stationary plates and the actuation plates are formed of a doped material so as to be electrically conductive. Upon application of a voltage potential between the respective plates, the actuation plates are pulled down toward the stationary plates, thus exerting a drive force on the base mirror plate to actuate the mirror between switching positions.

Abstract: A microactuator is disclosed including one or more stationary plates formed on a substrate, a mirror base plate on which a mirror is formed, and one or more actuation plates coupled to the mirror base plate by one or more microspring mechanisms. The mirror base plate, the one or more actuation plates and the one or more microspring mechanisms are suspended over the stationary plates by one or more anchors. The stationary plates and the actuation plates are formed of a doped material so as to be electrically conductive. Upon application of a voltage potential between the respective plates, the actuation plates are pulled down toward the stationary plates, thus exerting a drive force on the base mirror plate to actuate the mirror between switching positions.