Abstract: A semiconductor wafer pod includes a measurement sensor configured within a housing. The sensor faces towards a surface of a wafer being accommodated in the pod. The pod can be connected to the conventional load-port of a semiconductor wafer manufacturing tool. Thereby, measurement data can be collected immediately after wafer processing without a need to transport the wafer. The invention enables the cost-effective development of tool-integrated metrology.

Abstract: A low K dielectric composite layer is formed of a low k barrier layer and a low K dielectric layer on the barrier layer. The barrier layer, which is deposited with the result of having a hydrophobic top surface, is treated with an oxygen plasma to convert the surface from hydrophobic to hydrophilic. A subsequent water-based clean is very effective in removing yield-reducing defects on the barrier layer due to the conversion of the surface of the barrier layer. After the water-based clean, the low K dielectric layer is formed on the surface of the barrier layer to achieve the composite layer that has a low K.

Abstract: A semiconductor wafer pod includes a measurement sensor configured within a housing. The sensor faces towards a surface of a wafer being accommodated in the pod. The pod can be connected to the conventional load-port of a semiconductor wafer manufacturing tool. Thereby, measurement data can be collected immediately after wafer processing without a need to transport the wafer. The invention enables the cost-effective development of tool-integrated metrology.