Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.

Abstract: Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body having a longitudinal axis, a first group of input-side leads projecting from a first side of the package body and having an intra-group lead spacing, and a first group of output-side leads projecting from a second side of the package body and also having the intra-group lead spacing. A first carrier input lead projects from the first package body side and is spaced from the first group of input-side leads by an input-side isolation gap, which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead projects from the second package body side, is laterally aligned with the first carrier input lead, and is separated from the first group of output-side leads by an output-side isolation gap.

Abstract: Valuable metals, and especially copper and silver, are recovered from a lead containing electrolyte in a process in which the electrolyte is fed into an electrochemical polishing reactor that has a high-surface area cathode at which the electrode potential is controlled to so preferentially reduce copper and silver and to form a pre-treated lead-enriched electrolyte that can then be subjected electrochemical lead recovery.

Abstract: Power amplifier devices and methods for fabricating power amplifier devices containing frontside heat extraction structures are disclosed. In embodiments, the power amplifier device includes a substrate, a radio frequency (RF) power die bonded to a die support surface of the substrate, and a frontside heat extraction structure further attached to the die support surface. The frontside heat extraction structure includes, in turn, a transistor-overlay portion in direct thermal contact with a frontside of the RF power die, a first heatsink coupling portion thermally coupled to a heatsink region of the substrate, and a primary heat extraction path extending from the transistor-overlay portion to the first heatsink coupling portion. The primary heat extraction path promotes conductive heat transfer from the RF power die to the heatsink region and reduce local temperatures within a transistor channel of the RF power die during operation of the power amplifier device.

Abstract: Power amplifier devices and methods for fabricating power amplifier devices containing frontside heat extraction structures are disclosed. In embodiments, the power amplifier device includes a substrate, a radio frequency (RF) power die bonded to a die support surface of the substrate, and a frontside heat extraction structure further attached to the die support surface. The frontside heat extraction structure includes, in turn, a transistor-overlay portion in direct thermal contact with a frontside of the RF power die, a first heatsink coupling portion thermally coupled to a heatsink region of the substrate, and a primary heat extraction path extending from the transistor-overlay portion to the first heatsink coupling portion. The primary heat extraction path promotes conductive heat transfer from the RF power die to the heatsink region and reduce local temperatures within a transistor channel of the RF power die during operation of the power amplifier device.

Abstract: Power amplifier (PA) packages containing peripherally-encapsulated dies are provided, as are methods for fabricating such PA packages. In embodiments, a method for fabricating a PA package includes obtaining a die-substrate assembly containing a radio frequency (RF) power die, a package substrate, and a die bond layer. The die bond layer is composed of at least one metallic constituent and electrically couples a backside of the RF power die to the package substrate. A peripheral encapsulant body is formed around the RF power die and covers at least a portion of the die bond layer, while leaving at least a majority of a frontside of the RF power die uncovered. Before or after forming the peripheral encapsulant body, terminals of the PA package are interconnected with the RF power die; and a cover piece is bonded to the die-substrate assembly to enclose a gas-containing cavity within the PA package.

Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.

Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.

Abstract: Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body having a longitudinal axis, a first group of input-side leads projecting from a first side of the package body and having an intra-group lead spacing, and a first group of output-side leads projecting from a second side of the package body and also having the intra-group lead spacing. A first carrier input lead projects from the first package body side and is spaced from the first group of input-side leads by an input-side isolation gap, which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead projects from the second package body side, is laterally aligned with the first carrier input lead, and is separated from the first group of output-side leads by an output-side isolation gap.

Abstract: A method of manufacturing a subassembly for an exhaust treatment device includes providing a metal sheet including first and second apertures having respective first and second sizes, and a one-piece pipe including first and second linear portions having respective third and fourth sizes. The method further includes defining the first size based on a first difference between the first size and the third size being less than or equal to a predetermined value, and defining the second size based on manufacturing tolerances of the pipe to assure that the second linear portion will pass through the second aperture while the first linear portion passes through the first aperture. The method further includes fixing the first linear portion to the sheet, expanding the second linear portion from the fourth size to an enlarged size less than or equal to the predetermined value, and fixing the second linear portion to the sheet.

Abstract: A method includes providing a media dataset including media content data and environmental effects metadata defining a set of environmental events each corresponding to a media timestamp of a plurality of media timestamps. The method further includes, for each environmental event in the set of environmental events, identifying a protocol timestamp for a communication protocol, where the protocol timestamp corresponds to the media timestamp of the environmental event, and generating a message for transmission according the communication protocol, where the message associates the environmental event with the protocol timestamp. The method further includes addressing the message to one or more environmental effect generators.

Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.

Abstract: A method of manufacturing a subassembly for an exhaust treatment device includes providing a metal sheet including first and second apertures having respective first and second sizes, and a one-piece pipe including first and second linear portions having respective third and fourth sizes. The method further includes defining the first size based on a first difference between the first size and the third size being less than or equal to a predetermined value, and defining the second size based on manufacturing tolerances of the pipe to assure that the second linear portion will pass through the second aperture while the first linear portion passes through the first aperture. The method further includes fixing the first linear portion to the sheet, expanding the second linear portion from the fourth size to an enlarged size less than or equal to the predetermined value, and fixing the second linear portion to the sheet.

Abstract: Methods, systems, and apparatuses are described for determining relative locations of wireless loudspeakers and performing channel mapping thereof. An audio processing component utilizes sounds produced by wireless loudspeakers during setup/installation procedures, which are received by a microphone at locations in an acoustic space, to determine an amount of time between when the audio signal is initially transmitted and when the microphone signal is received. The audio processing component also utilizes wireless timing signals provided by a wireless transceiver, at locations in the acoustic space, to wireless loudspeakers and then back to the wireless transceiver to determine an amount of time between transmission and reception by the wireless transceiver. The timing delays are used to determine the locations of the wireless loudspeakers in the acoustic space.

Abstract: A method includes providing a media dataset including media content data and environmental effects metadata defining a set of environmental events each corresponding to a media timestamp of a plurality of media timestamps. The method further includes, for each environmental event in the set of environmental events, identifying a protocol timestamp for a communication protocol, where the protocol timestamp corresponds to the media timestamp of the environmental event, and generating a message for transmission according the communication protocol, where the message associates the environmental event with the protocol timestamp. The method further includes addressing the message to one or more environmental effect generators.

Abstract: Methods, systems, and apparatuses are described for determining relative locations of wireless loudspeakers and performing channel mapping thereof. An audio processing component utilizes sounds produced by wireless loudspeakers during setup/installation procedures, which are received by a microphone at locations in an acoustic space, to determine an amount of time between when the audio signal is initially transmitted and when the microphone signal is received. The audio processing component also utilizes wireless timing signals provided by a wireless transceiver, at locations in the acoustic space, to wireless loudspeakers and then back to the wireless transceiver to determine an amount of time between transmission and reception by the wireless transceiver. The timing delays are used to determine the locations of the wireless loudspeakers in the acoustic space.

Abstract: Methods, systems, and apparatuses are described for determining relative locations of wireless loudspeakers and performing channel mapping thereof. An audio processing component utilizes sounds produced by wireless loudspeakers during setup/installation procedures, which are received by a microphone at locations in an acoustic space, to determine an amount of time between when the audio signal is initially transmitted and when the microphone signal is received. The audio processing component also utilizes wireless timing signals provided by a wireless transceiver, at locations in the acoustic space, to wireless loudspeakers and then back to the wireless transceiver to determine an amount of time between transmission and reception by the wireless transceiver. The timing delays are used to determine the locations of the wireless loudspeakers in the acoustic space.

Abstract: A circuit protection device having operational parameters configurable only via a separate programming device includes a memory configured to receive a selector identifying one of a plurality of operational parameters to be adjusted, and to receive a parameter value from the programming device. A processor is coupled to the memory and is configured to receive the selector from the memory, select the operational parameter of the circuit protection device based on the selector, and to receive a parameter value for the operational parameter from memory, and set the selected operational parameter to the parameter value.

Abstract: A mixer for mixing an exhaust flow in an exhaust pipe includes a tubular housing having a first end, a second end and a center portion positioned between the ends. The center portion has a reduced size in relation to at least one of the first and second ends. The housing includes circumferentially spaced apart apertures extending through the center portion. A mixing element includes a body having a first peripheral portion and a second peripheral portion. The first peripheral portion is fixed to the center portion at a location adjacent to one of the apertures. The second peripheral portion is fixed to the center portion at a location adjacent to another one of the apertures.

Abstract: Power distribution systems and methods are described. In one example, a method of testing a power distribution system including a first circuit protection device and a second circuit protection device coupled to the first circuit protection device downstream of the first circuit protection device is described. The method includes monitoring a status of a communicative connection between a ZSI output port of the first circuit protection device and a ZSI input port of the second circuit protection device with a ZSI monitor of the first circuit protection device, detecting whether the ZSI output port of the first circuit protection device is coupled to the ZSI input port of the second circuit protection device, and indicating the status of the communicative connection.