Abstract: A containment device for retaining semiconductor wafers having a first housing member having a frame with inner and outer walls normal to the frame having a gapped relation. The inner wall receives the semiconductor wafers. A second housing member securably attachable to the first housing member by plural latches has a frame forming the top of the device. Each latch has a hook secured to the first housing member passing through a hole in the second housing member and releasably secured within the hole by the hook. In a second embodiment, the latches and holes are replaced with a plurality of rotatable latch members each having a hook at the distal end for engagement with a hole in the second housing member, secured to the first housing member and rotatable about a hinge. One wall of the first embodiment is replaced with a soft liner which absorbs shock.

Abstract: A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together.

Abstract: A containment device for retaining semiconductor wafers (54) which includes a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16), the inner wall (14) and outer wall (16) having a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also includes a second housing member (36) that is securably attachable to the first housing member (10) and which has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together. The first and second housing members are secured by a plurality of latches (20), each with a hook (22) secured to the first housing member which passes through a hole (40) in the second housing member and is releasably secured within the hole by the hook.

Abstract: A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together.

Abstract: A cross-winding machine comprises a winding mandrel and means for rotating the mandrel so that yarn supplied thereto is formed on the mandrel into a cross-wound package. Reciprocably movable doffing means transfer a wound package on the mandrel to a position which permits winding of a further package. A package support extends in alignment with the end of the mandrel and receives and supports packages successively doffed by the doffing means, thread severing means being provided which operate to cut thread between the mandrel and the package support.