Abstract: Electronic assemblies for medical devices are described, including an electronic assembly that includes a body, at least one imaging device, and at least one light source. The body may include a plurality of electrical connection points and a plurality of electrical traces in a material that is electrically insulative. The plurality of electrical connection points may be on one or more external surfaces of the body. The plurality of electrical connection points may include proximal and distal connection points. Each electrical trace may connect a proximal connection point to a respective distal connection point. The at least one imaging device may be coupled to one or more of the distal connection points and/or the at least one light source may be coupled to one or more of the distal connection points.

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: A flexible circuit assembly for a medical device, the circuit assembly including a circuit board having at least one bending portion and at least one flat portion, and a mechanical support structure coupled to the circuit board. The mechanical support structure includes a first region and a second region extending distally from the first region. The at least one bending portion of the circuit board is a portion of an arm, the arm extending distally from the flat portion, and the at least one bending portion of the circuit board is coupled to the second region of the mechanical support structure.

Abstract: This document discusses, among other things, systems and methods to fabricate and operate an implantable medical device. The implantable medical device can include a housing portion defining an interior chamber. The implantable medical device can include a circuit in the interior chamber. The implantable medical device can include a first electronic component that is not in the interior chamber. The implantable medical device can include a substrate coupled to the housing, the substrate including a first via extending through the substrate, the first via electrically coupling the first electronic component to the circuit.

Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Abstract: A sensor assembly includes a substrate including a first portion, a second portion, and a rolled section positioned between the first portion and the second portion. The sensor assembly further includes a first magnetic field sensor coupled to the first portion. The first magnetic field sensor has a primary sensing direction aligned with a longitudinal axis of the sensor assembly. The sensor assembly further includes a second magnetic field sensor coupled to the second portion. The rolled section is shaped such that the second magnetic field sensor is oriented with respect to the first magnetic field sensor so that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: Devices and circuits for reducing sizes of medical devices are disclosed. In one example, an implantable medical device (IMD) may include a housing, multiple electrodes outside of the housing, an energy storage device within the housing, and a circuit within the housing and connected to the energy storage device and the two or more electrodes. In some cases, the circuit may include two or more island sections, with each island section connected to at least one other island section by a ribbon section. Each island section may have two opposing major surfaces. A first island section and a second island section may be stacked within the housing such that one of the two major surfaces of the first island section faces one of the two opposing major surfaces of the second island section.

Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Abstract: A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Abstract: A sensor assembly comprising a base member extending along a longitudinal axis and including a first portion, a second portion, and a twist section positioned between the first portion and the second portion. The sensor assembly further includes a first magnetic field sensor coupled to the first portion, wherein the first magnetic field sensor has a primary sensing direction aligned with the longitudinal axis, and a second magnetic field sensor coupled to the second portion, wherein the second magnetic field sensor is oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: A sensor assembly includes a substrate including a first portion, a second portion, and a rolled section positioned between the first portion and the second portion. The sensor assembly further includes a first magnetic field sensor coupled to the first portion. The first magnetic field sensor has a primary sensing direction aligned with a longitudinal axis of the sensor assembly. The sensor assembly further includes a second magnetic field sensor coupled to the second portion. The rolled section is shaped such that the second magnetic field sensor is oriented with respect to the first magnetic field sensor so that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Abstract: This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Abstract: This document discusses, among other things, systems and methods to fabricate and operate an implantable medical device. The implantable medical device can include a housing portion defining an interior chamber. The implantable medical device can include a circuit in the interior chamber. The implantable medical device can include a first electronic component that is not in the interior chamber. The implantable medical device can include a substrate coupled to the housing, the substrate including a first via extending through the substrate, the first via electrically coupling the first electronic component to the circuit.

Abstract: A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract: A position sensor assembly includes a base member having a proximal portion, a distal portion, and an intermediate portion disposed therebetween and having a twisted configuration such that the proximal and distal portions are oriented in mutually orthogonal planes. At least first and second magnetic field sensors each including at least one magnetic field sensing element are disposed, respectively, on the proximal and distal portions of the base member. The base member further includes a first base member element defining the proximal portion of the base member, and a second base member element defining the distal portion of the base member, the first and second base member elements being electrically and mechanically connected at a joint.