Patents by Inventor James E. Davis
James E. Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240085131Abstract: A mounting platform is provided for securing munitions. The platform includes a flat plate, a front block and a rear block. The plate includes a plurality of cutout holes. The front block has a first saddle disposed between first flanking ends and at least one extension at one of the flanking ends for inserting into a first opening of the cutouts. The rear block has a second saddle disposed between second flanking ends at least one extension for inserting into a second opening of the cutouts. The munitions are disposable atop the first and second saddles of the front and rear blocks. The munitions are restrained axially against a rear stop block and laterally by the saddles and straps.Type: ApplicationFiled: September 12, 2022Publication date: March 14, 2024Applicant: United States of America, as represented by the Secretary of the NavyInventors: James E. Howell, Matthew James O'Neill, Jonathan F. Pfab, Vernon Todd Davis, Vincent J. Vendetti, Carl S. Lynn, IV
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Publication number: 20240071516Abstract: A discharge circuit includes a transistor and a metal resistor connected to the transistor. The transistor includes a plurality of unit cells. The metal resistor includes a plurality of resistor portions corresponding to the plurality of unit cells. Each unit cell of the plurality of unit cells has a footprint and a corresponding resistor portion of the plurality of resistor portions is arranged within the footprint.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: MICRON TECHNOLOGY, INC.Inventors: Kenneth W. Marr, James E. Davis, Chiara Cerafogli
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Publication number: 20240074001Abstract: An aerosol delivery device having a detachable power source is provided. A control body may be coupleable with a cartridge to form an aerosol delivery device. The cartridge may contain an aerosol precursor composition and be equipped with a heating element configured to activate and vaporize components of the aerosol precursor composition. The control body may comprise a housing and a power source detachably coupled to an outer surface of the housing. A control component may be contained within the housing and configured to operate in an active mode in which the control body is coupled with the cartridge. The control component in the active mode may be configured to direct power from the power source to the heating element to activate and vaporize components of the aerosol precursor composition.Type: ApplicationFiled: November 2, 2023Publication date: February 29, 2024Inventors: Michael F. Davis, Percy D. Phillips, James W. Rogers, Lisa E. Brown, James Demopoulos
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Patent number: 11908812Abstract: A memory device including a substrate including a substrate contact pad. The memory device includes a first memory die including a first power supply contact pad electrically coupled to the substrate contact pad and a first power supply circuit on the first memory die. The first memory die further includes a first electrostatic discharge (ESD) power clamp contact pad electrically coupled to the substrate contact pad and a first ESD power clamp circuit on the first memory die. The memory device further includes a second memory die including a second power supply contact pad electrically coupled to the substrate contact pad and a second power supply circuit on the second memory die and a second ESD power clamp contact pad electrically coupled to a second ESD power clamp circuit on the second memory die, wherein the second ESD power clamp contact pad is electrically disconnected from the substrate contact.Type: GrantFiled: February 16, 2021Date of Patent: February 20, 2024Assignee: Micron Technology, Inc.Inventors: Yui Shimizu, James E. Davis
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Publication number: 20240038759Abstract: An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.Type: ApplicationFiled: September 29, 2023Publication date: February 1, 2024Inventors: James E. Davis, Milind Nemchand Furia, Michael D. Chaine, Eric J. Smith
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Patent number: 11848323Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: February 18, 2021Date of Patent: December 19, 2023Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Patent number: 11798935Abstract: An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.Type: GrantFiled: July 22, 2022Date of Patent: October 24, 2023Assignee: Micron Technology, Inc.Inventors: James E. Davis, Milind Nemchand Furia, Michael D. Chaine, Eric J. Smith
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Patent number: 11537958Abstract: A data driven workflow solution that normalizes business communications by systematically recording related business communications from disparate communications channels in a common format such that the related business communications are automatically integrated into the associated business processes and which flow solution is flexible for capturing additional data elements or to adapt to changing tasks associated with the business processes is disclosed.Type: GrantFiled: June 10, 2016Date of Patent: December 27, 2022Assignee: Radaptive, Inc.Inventors: James E. Davis, Balasubramaniam Ganesh, Kenneth L. Holmes
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Patent number: 11508657Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: GrantFiled: August 11, 2020Date of Patent: November 22, 2022Assignee: Micron Technology, Inc.Inventors: James E. Davis, Kevin G. Duesman
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Publication number: 20220359495Abstract: An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.Type: ApplicationFiled: July 22, 2022Publication date: November 10, 2022Inventors: James E. Davis, Milind Nemchand Furia, Michael D. Chaine, Eric J. Smith
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Patent number: 11424169Abstract: Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.Type: GrantFiled: August 8, 2019Date of Patent: August 23, 2022Assignee: Micron Technology, Inc.Inventors: Chiara Cerafogli, Kenneth William Marr, Brian J. Soderling, Michael P. Violette, Joshua Daniel Tomayer, James E. Davis
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Patent number: 11398468Abstract: An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.Type: GrantFiled: December 12, 2019Date of Patent: July 26, 2022Assignee: Micron Technology, Inc.Inventors: James E. Davis, Milind Nemchand Furia, Michael D. Chaine, Eric J. Smith
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Publication number: 20220199554Abstract: A memory device including a substrate including a substrate contact pad. The memory device includes a first memory die including a first power supply contact pad electrically coupled to the substrate contact pad and a first power supply circuit on the first memory die. The first memory die further includes a first electrostatic discharge (ESD) power clamp contact pad electrically coupled to the substrate contact pad and a first ESD power clamp circuit on the first memory die. The memory device further includes a second memory die including a second power supply contact pad electrically coupled to the substrate contact pad and a second power supply circuit on the second memory die and a second ESD power clamp contact pad electrically coupled to a second ESD power clamp circuit on the second memory die, wherein the second ESD power clamp contact pad is electrically disconnected from the substrate contact.Type: ApplicationFiled: February 16, 2021Publication date: June 23, 2022Inventors: Yui Shimizu, James E. Davis
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Patent number: 11056467Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.Type: GrantFiled: October 2, 2019Date of Patent: July 6, 2021Assignee: Micron Technology, Inc.Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer
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Publication number: 20210183851Abstract: An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.Type: ApplicationFiled: December 12, 2019Publication date: June 17, 2021Inventors: James E. Davis, Milind Nemchand Furia, Michael D. Chaine, Eric J. Smith
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Publication number: 20210175228Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: ApplicationFiled: February 18, 2021Publication date: June 10, 2021Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Patent number: 10930645Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.Type: GrantFiled: January 15, 2020Date of Patent: February 23, 2021Assignee: Micron Technology, Inc.Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
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Publication number: 20210043525Abstract: Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.Type: ApplicationFiled: August 8, 2019Publication date: February 11, 2021Inventors: Chiara Cerafogli, Kenneth William Marr, Brian J. Soderling, Michael P. Violette, Joshua Daniel Tomayer, James E. Davis
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Patent number: 10867991Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first contact pad, and the substrate is electrically isolated from the second contact pad.Type: GrantFiled: December 27, 2018Date of Patent: December 15, 2020Assignee: Micron Technology, Inc.Inventors: Kevin G. Duesman, James E. Davis, Warren L. Boyer, Jeffrey P. Wright
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Publication number: 20200373238Abstract: Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.Type: ApplicationFiled: August 11, 2020Publication date: November 26, 2020Inventors: James E. Davis, Kevin G. Duesman