Abstract: An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: A wave energy converter (WEC) system includes WEC devices which can function to produce useful energy (power) efficiently in response to heave motion and/or pitch motion and/or roll motion. Pitch responsive devices are deployed around the outer periphery of a container and one (or more) heave responsive device is located about the center of the container. The pitch responsive devices may be of the type defined as PDWECs which include two reaction masses which are primarily operable in response to pitching motion or they may be of the type which includes one reaction mass operable in response to pitch and/or heave motion.

Abstract: Apparatus, intended to be deployed in a body of water, includes a payload comprised of a multiplicity of different electronic and electromechanical loads and a wave energy converter (WEC) system responsive to the amplitude of waves in the body of water for producing electrical power, which is a function of the wave amplitudes, to power the payload. The apparatus includes switching circuitry for controlling the application of power to selected ones of the loads. Control circuitry and devices which are responsive to the electric power being produced control the switching circuitry for controlling the amount of power supplied to, and consumed by, the loads.

Abstract: A wave energy converter (WEC) includes a float tending to move in phase with the waves, a spar tending to move out of phase with the float and power take off device (PTO) coupled between the float and spar for converting their relative motion into useful energy. The PTO includes a rack and pinion mechanism which drives a high-torque, multi-pole, permanent magnet generator (PMG) to produce electrical signals of relatively high frequency relative to the frequency of the waves and the basic motion of the rack and pinion mechanism. In accordance with one aspect of the invention, the rack and pinion mechanism may be located within the spar which may be hermetically sealed by a sealing mechanism which allows a thrust rod coupled between the float and spar to move up and down with little friction to ensure efficient operation. In addition, a braking arrangement is provided for inhibiting relative motion between the float and spar during extreme severe wave conditions.

Abstract: A wave energy converter (WEC) system includes WEC devices which can function to produce useful energy (power) efficiently in response to heave motion and/or pitch motion and/or roll motion. Pitch responsive devices are deployed around the outer periphery of a container and one (or more) heave responsive device is located about the center of the container. The pitch responsive devices may be of the type defined as PDWECs which include two reaction masses which are primarily operable in response to pitching motion or they may be of the type which includes one reaction mass operable in response to pitch and/or heave motion.

Abstract: Apparatus, intended to be deployed in a body of water, includes a payload comprised of a multiplicity of different electronic and electromechanical loads and a wave energy converter (WEC) system responsive to the amplitude of waves in the body of water for producing electrical power, which is a function of the wave amplitudes, to power the payload. The apparatus includes switching circuitry for controlling the application of power to selected ones of the loads. Control circuitry and devices which are responsive to the electric power being produced control the switching circuitry for controlling the amount of power supplied to, and consumed by, the loads.

Abstract: A wave energy converter (WEC) includes a float tending to move in phase with the waves, a spar tending to move out of phase with the float and power take off device (PTO) coupled between the float and spar for converting their relative motion into useful energy. The PTO includes a rack and pinion mechanism which drives a high-torque, multi-pole, permanent magnet generator (PMG) to produce electrical signals of relatively high frequency relative to the frequency of the waves and the basic motion of the rack and pinion mechanism. In accordance with one aspect of the invention, the rack and pinion mechanism may be located within the spar which may be hermetically sealed by a sealing mechanism which allows a thrust rod coupled between the float and spar to move up and down with little friction to ensure efficient operation. In addition, a braking arrangement is provided for inhibiting relative motion between the float and spar during extreme severe wave conditions.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: The present invention is directed to an integrated flexure mount scheme for dynamic isolation of ultrasonic transducers for use with a wire bonding machine. The transducer has a body of a generally elongated shape having front, rear, and main portions. The transducer has mounting flanges for mounting the transducer to the wire bonding machine. The mounting flanges have at least two integrated flexures that connect the mounting flange to the main portion of the transducer body and define at least one flexure orifice.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.