Abstract: A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.

Abstract: A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.

Abstract: A refractory material can include a refractory filament and an interface coating applied to the refractory filament. The interface coating can include a refractory metal or semi-metal oxide, metal or semi-metal nitride, metal or semi-metal carbide, metal or semi-metal oxynitride, metal or semi-metal carbonitride, and/or metal or semi metal oxycarbide formed by depositing an organometallic precursor onto the refractory filament by supercritical fluid deposition and heat treating the organometallic precursor in the presence of an atmospheric condition so that the organometallic precursor forms an interface coating that is an oxidized, pyrolyzed, or carbidized form of the organometallic precursor and is present at a surface and beneath the surface of the refractory filament.

Abstract: A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.

Abstract: An apparatus includes a first layer having an RF lossy material, a second layer having the RF lossy material, and a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer. The apparatus may also include a plurality of thermal vias, where each thermal via may correspond to one of the pads, may extend through at least the first layer, and may be formed of a thermally-conductive material. Dimensions of each pad may be selected based on a desired resonant frequency band, and the desired resonant frequency band may be associated with RF energy transmitted by at least one RF source in proximity to the apparatus.

Abstract: An apparatus includes a first layer having an RF lossy material, a second layer having the RF lossy material, and a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer. The apparatus may also include a plurality of thermal vias, where each thermal via may correspond to one of the pads, may extend through at least the first layer, and may be formed of a thermally-conductive material. Dimensions of each pad may be selected based on a desired resonant frequency band, and the desired resonant frequency band may be associated with RF energy transmitted by at least one RF source in proximity to the apparatus.

Abstract: An improved durable, low density, high build polyurethane coating is disclosed, as well as its method of manufacture. A slow reacting polyisocyanate is combined with a polyol so as to form a uniform mixture with an extremely long pot life. The low viscosity uniform mixture can then be sprayed onto a substrate using a conventional spray gun. A polyurethane catalyst is introduced after formation of the uniform mixture, preferably via a second spray nozzle so that catalyst is externally mixed into the polyisocyanate/polyol spray stream. This is a 100%, or near 100%, solids system so that there is very low volatile organic compound emissions.

Abstract: An improved durable, low density, high build polyurethane coating is disclosed, as well as its method of manufacture. A slow reacting polyisocyanate is combined with a polyol so as to form a uniform mixture with an extremely long pot life. The low viscosity uniform mixture can then be sprayed onto a substrate using a conventional spray gun. A polyurethane catalyst is introduced after formation of the uniform mixture, preferably via a second spray nozzle so that catalyst is externally mixed into the polyisocyanate/polyol spray stream. This is a 100%, or near 100%, solids system so that there is very low volatile organic compound emissions.

Abstract: In a method for fabricating a reusable conformal photomask for a doubly contoured hemispherical substrate such as a radome or a three-dimensional printed circuit board, a light blocking material is deposited on a shell or tool corresponding to the shape of the radome or printed circuit board. A pattern is then formed in the light blocking material, and portions of the light blocking material corresponding to the pattern are removed. The resulting pattern corresponds to the pattern to be formed on the three-dimensional printed circuit board or radome. A light transmissive layer is then deposited over the light blocking layer for support. The light blocking material and the light transmissive material comprise the reusable conformal photomask which is then removed from the shell. The reusable conformal photomask can be used to form an image of the desired pattern on the three-dimensional printed circuit board or radome.

Abstract: A process for the gelling of a silicone varnish comprises reacting the silicone varnish with an organic coupling agent, preferably an organometallic coupling agent under conditions which are effective and to provide a gel. This gel has a viscosity which is effective for suspending high density particles in the resin without settling of the particles during subsequent processing such as spraying, casting, and/or curing processes. The silicone varnish contains hydroxyl substituents, and is preferably a polyhydroxy substituted silicone varnish, i.e., silanols.