Abstract: A mechanism for handling semiconductor wafers includes a feed section which comprises a vertically movable elevator able to hold a number of vertically spaced carriers. Each carrier has a film frame mounted thereon for supporting a wafer. A pulling mechanism pulls a selected carrier out of the elevator along a first axis and into a pick and place section. A transfer mechanism removes individual dies from the wafer and moves them to a flip station along a second axis oriented perpendicularly to the first axis. The transfer mechanism can move different distances along the second axis to be able to remove dies arranged in a row along the second axis. The flip station is driven by a single motor to both lower and invert the dies.

Abstract: The present invention provides a structure for use in self-biasing and source bypassing a packaged, field-effect transistor (FET) having first and second leads. The structure is readily assembled and provides an excellent noise figure.

Abstract: A method and apparatus is disclosed for handling single in-line packaged (SIP) components wherein the components are individually selected from a plurality of magazine supplies, transported to a gauging station at which the leads thereof are straightened and aligned and electrical functioning of the component is tested, and transferred from the gauging station to an insert station at which the leads thereof are inserted into corresponding holes of a printed circuit board.