Patents by Inventor James E. Larkin

James E. Larkin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit having an improved bond pad
    Patent number: 4959706
    Abstract: An improved bond pad on an integrated circuit has an elongated rectangular shape, on which the wire is bonded at a non-central location displaced toward an outer corner, so that there is room on the pad for a second bond site to be used for a rework bond. The pad corner closest to the path of a wire may be chamfered to reduce the distance of closest approach.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: September 25, 1990
    Assignee: United Technologies Corporation
    Inventors: Michael D. Cusack, Michael P. Hagen, James E. Larkin