Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

Abstract: A strain-responsive sensor incorporating a strain-sensitive element is disclosed. The strain-sensitive element includes a matched-pair of resistive structures disposed on opposite sides of a substrate. One resistive structure of the matched pair is coupled to a crossover, either a physical crossover or a soft crossover, such that current within the resistive structures of the matched pair flows in the same direction.

Abstract: One or more transparent transistor force sensitive structures can be included in an electronic device. The transistor force sensitive structures(s) is used to detect a force that is applied to the electronic device, to a component in the electronic device, and/or to an input region of the electronic device. As one example, the one or more transparent transistor force sensitive structures may be included in a display stack of a display in an electronic device.

Abstract: An electronic device is configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. The localized haptic feedback is provided by an array of piezoelectric haptic actuators below the surface of the electronic device. Actuators within the array of piezoelectric haptic actuators are separately controllable by a control circuit layer. The control circuit layer includes control circuitry, a master flexible circuit which passes between rows of actuators, and an array of slave flexible circuits. Each slave flexible circuit is connected to the master flexible circuit and an actuator. In further examples, the array of piezoelectric haptic actuators provides a unified structure for detecting touch and force inputs.

Abstract: One or more transparent transistor force sensitive structures can be included in an electronic device. The transistor force sensitive structures(s) is used to detect a force that is applied to the electronic device, to a component in the electronic device, and/or to an input region of the electronic device. As one example, the one or more transparent transistor force sensitive structures may be included in a display stack of a display in an electronic device.

Abstract: An electronic device includes one or more transparent strain sensors configured to detect strain based on an amount of force applied to the electronic device, a component in the electronic device, and/or an input surface of the electronic device. The one or more transparent strain sensors may be included in or positioned below an input surface that is configured to receive touch inputs from a user. The area below the input surface can be visible to a user when the user is viewing the input surface. The one or more transparent strain sensors are formed with a nanostructure, including a nanomesh or nanowires.

Abstract: An optically transparent conductive layer for a display stack. In some cases, the optically transparent conductive layer is a metal nanowire layer that is disposed on or near a polarizing layer within the display stack.

Abstract: In some embodiments, a haptic actuator includes piezoelectric material and a pattern of voltage electrodes coupled to a surface of the piezoelectric material. The voltage electrodes are individually controllable to supply voltage to different portions of the piezoelectric material. Different sections of the piezoelectric material are operable to deflect, producing haptic output at those locations, in response to the application of the voltage. Differing voltages may be provided to one or more of the voltage electrodes to affect the location of the deflection, and thus the haptic output. In various embodiments, a haptic output system incorporates a sealed haptic element. The sealed haptic element includes a piezoelectric component that is coupled to one or more flexes and is sealed and/or enclosed by the flex(es) and an encapsulation or sealing material.

Abstract: An electronic device configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. A support structure is positioned below the surface, and one or more haptic actuators are coupled to the support structure. In some examples, the support structure is shaped or configured to amplify a response to a haptic actuator. When a haptic actuator is actuated, the support structure deflects, which causes the surface to bend or deflect at a location that substantially corresponds to the location of the activated haptic actuator. In some examples, prior to providing haptic feedback, at least one haptic actuator is electrically pre-stressed to place the haptic actuator(s) in a pre-stressed state. When haptic feedback is to be provided, at least one haptic actuator transitions from the pre-stressed state to a haptic output state to produce one or more deflections in the surface.

Abstract: An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.

Abstract: An optical force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: A force sensor is disclosed. The force sensor includes a force-sensitive structure that compensates for temperature and other environmental changes through the use of a strain-sensitive element and one or more reference elements. An array of such force-sensitive structures forms a force-sensing layer.

Abstract: A transparent force sensor for detecting an applied force on a surface of a device. The transparent force sensor includes a transparent force-sensitive film having an array of strain-relief features oriented along a first direction. The transparent force-sensitive film is formed from a transparent piezoelectric material that exhibits a substantially reduced net charge when strained along a primary direction. The force sensor also includes a display element disposed on one side of the transparent force-sensitive film.

Abstract: An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Abstract: A strain-responsive sensor incorporating a strain-sensitive element is disclosed. The strain-sensitive element includes a matched-pair of resistive structures disposed on opposite sides of a substrate. One resistive structure of the matched pair is coupled to a crossover, either a physical crossover or a soft crossover, such that current within the resistive structures of the matched pair flows in the same direction.

Abstract: One or more strain sensors can be included in an electronic device. Each strain sensor includes a strain sensitive element and one or more strain signal lines connected directly to the strain sensitive element. The strain sensor(s) are used to detect a force that is applied to the electronic device, to a component in the electronic device, and/or to an input region or surface of the electronic device. A strain sensitive element is formed or processed to have a first gauge factor and the strain signal line(s) is formed or processed to have a different second gauge factor. Additionally or alternatively, a strain sensitive element is formed or processed to have a first conductance and the strain signal line(s) is formed or processed to have a different second conductance.

Abstract: An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Abstract: One or more strain sensors can be included in an electronic device. Each strain sensor includes a strain sensitive element and one or more strain signal lines connected directly to the strain sensitive element. The strain sensor(s) are used to detect a force that is applied to the electronic device, to a component in the electronic device, and/or to an input region or surface of the electronic device. A strain sensitive element is formed or processed to have a first gauge factor and the strain signal line(s) is formed or processed to have a different second gauge factor. Additionally or alternatively, a strain sensitive element is formed or processed to have a first conductance and the strain signal line(s) is formed or processed to have a different second conductance.