Abstract: A test fixture for use in systems designed to test circuit boards. The test fixture is adapted to receive pre-wired interchangeable modules which contain a plurality of fixed test probes disposed in an array mirroring the location of test points on the specific circuit board to be tested. The interchangeable modules have standardized arrays of intermediate connectors for mating with mirrored arrays of connectors on the frame of the test fixture.

Abstract: A printed circuit board testing means is disclosed comprising a rectangularly-shaped base structure having a forwardly inclined top front face that is oriented continuously to an interchangeable hinged top mounted platen structure resting thereon which incorporates a pair of fixedly mounted guide rails. A ledge-like structure located at the front edge of the top mounted platen is adjacent to a locating contact pin module incorporated in said platen structure and has guide pins.A test head interface assembly is slid into co-planar contact and alignment with the platen structure utilizing the guide rail means and ledge guide pins, thereby aligning the locating contact pin modules with the associated test head interface assembly electrical contacts and vacuum source. Movement of a lever operated control interface lowering means incorporated in the base structure housing will then lower the test head interface assembly into electrical contact and vacuum contact with the locating contact pin modules.