Patents by Inventor James E. Rychwalski

James E. Rychwalski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic copper plating solutions
    Publication number: 20030010646
    Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Application
    Filed: August 22, 2002
    Publication date: January 16, 2003
    Inventors: Leon R. Barstad, James E. Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin, Robert A. Schetty, Michael Toben
  • Electrolytic copper plating method
    Patent number: 6444110
    Abstract: The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: September 3, 2002
    Assignee: Shipley Company, L.L.C.
    Inventors: Leon R. Barstad, James E. Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin, Robert A. Schetty, III, Michael Toben
  • Conditioning process for electroless plating of polyetherimides
    Patent number: 5441770
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: August 15, 1995
    Assignee: Shipley Company Inc.
    Inventors: James E. Rychwalski, Paul J. Ciccolo, Robert B. Currie, Philip D. Knudsen