Abstract: A method of coupling electronic devices into electrical circuits, particularly hybrid circuits and the like, by utilizing a pre-formed lead frame. The lead frame is formed from a gold film or the like and provides smooth width variations between the signal carrying lines of the circuit and the terminal portions of the device. Wobble bonding and wire bonding processes are adapted for use in practicing the invention. High frequency and/or wide band circuits are significantly improved by use of the present invention as opposed to prior art wire bonding techniques.