Patents by Inventor James E. Tersigni

James E. Tersigni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10251288
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: April 2, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, Thomas Weiss, James E. Tersigni
  • Publication number: 20180110142
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Application
    Filed: December 11, 2017
    Publication date: April 19, 2018
    Inventors: Michael J. FISHER, David C. LONG, Michael T. PEETS, Robert WEISS, Thomas WEISS, James E. TERSIGNI
  • Patent number: 9913389
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 6, 2018
    Assignee: INTERNATIONAL BUSINESS CORPORATION CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, Thomas Weiss, James E. Tersigni
  • Publication number: 20170156223
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Application
    Filed: December 1, 2015
    Publication date: June 1, 2017
    Inventors: Michael J. FISHER, David C. LONG, Michael T. PEETS, Robert WEISS, Thomas WEISS, James E. TERSIGNI
  • Patent number: 8939791
    Abstract: A primary circuit board has a front surface, a back surface, and a non-conductive void. The void has first planar dimensions through a first portion of a thickness of the primary circuit board extending from the front surface to a position between the front and back surfaces, and second planar dimensions through a second portion of the thickness extending from the position at least towards the back surface. A secondary circuit board holder includes a non-conducting locking member insertable into the non-conductive void at the primary circuit board's front surface to secure the holder while a conductive part of the holder is conductively affixed to a conductive part of the primary circuit board. The first planar dimensions are different than the second planar dimensions to permit the primary circuit board's thickness to be greater than a maximum thickness specification of the holder's non-conducting locking member.
    Type: Grant
    Filed: January 27, 2013
    Date of Patent: January 27, 2015
    Assignee: International Business Machines Corporation
    Inventors: Wai M. Ma, James E. Tersigni, Jefferson L. Watson
  • Patent number: 8902605
    Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: December 2, 2014
    Assignee: International Business Machines Corporation
    Inventors: Daniel J. Buschel, Wai Mon Ma, James E. Tersigni, Raymond D. Birchall
  • Patent number: 8845206
    Abstract: An apparatus is provided and includes a housing, a block formed to define an array of holes corresponding to an array of plugs into which connectors with spring loaded sleeves are pluggable such that the block engages with a respective sleeve of each connector, the block being supportively disposed within the housing to be movable with respect to the housing between first and second block positions at which the sleeves are extended and retracted, respectively and a cam lever supported on the housing and coupled to the block, which selectively occupies first and second lever positions at which the cam lever causes the block to assume the first and second block positions, respectively.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: September 30, 2014
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Y. Chan, Dennis Denizard, Michael J. Fisher, Gilles G. Labbe, James E. Tersigni
  • Publication number: 20140213077
    Abstract: A primary circuit board has a front surface, a back surface, and a non-conductive void. The void has first planar dimensions through a first portion of a thickness of the primary circuit board extending from the front surface to a position between the front and back surfaces, and second planar dimensions through a second portion of the thickness extending from the position at least towards the back surface. A secondary circuit board holder includes a non-conducting locking member insertable into the non-conductive void at the primary circuit board's front surface to secure the holder while a conductive part of the holder is conductively affixed to a conductive part of the primary circuit board. The first planar dimensions are different than the second planar dimensions to permit the primary circuit board's thickness to be greater than a maximum thickness specification of the holder's non-conducting locking member.
    Type: Application
    Filed: January 27, 2013
    Publication date: July 31, 2014
    Applicant: International Business Machines Corporation
    Inventors: Wai M. Ma, James E. Tersigni, Jefferson L. Watson
  • Publication number: 20130337697
    Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 19, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel J. Buschel, Wai Mon Ma, James E. Tersigni, Raymond D. Birchall
  • Publication number: 20120251054
    Abstract: An apparatus is provided and includes a housing, a block formed to define an array of holes corresponding to an array of plugs into which connectors with spring loaded sleeves are pluggable such that the block engages with a respective sleeve of each connector, the block being supportively disposed within the housing to be movable with respect to the housing between first and second block positions at which the sleeves are extended and retracted, respectively and a cam lever supported on the housing and coupled to the block, which selectively occupies first and second lever positions at which the cam lever causes the block to assume the first and second block positions, respectively.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 4, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kenneth Y. Chan, Dennis Denizard, Michael J. Fisher, Gilles G. Labbe, James E. Tersigni