Patents by Inventor James E. Trimble

James E. Trimble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5223787
    Abstract: A high-speed, low-profile logic analyzer test probe has a body of insulating material molded directly onto a narrow elongate substrate having electrical circuitry disposed thereon. The molded insulating material has a notch formed therein for exposing a conductive surface formed on the substrate. The exposed conductive surface is used for making a ground connection between the substrate and the ground of a device under test. The probe may be adapted for use in probe holder for multichannel probing wherein the probe holder has an electrically conductive chip disposed within the probe holder housing for providing the shortest possible ground connections between the ground pins on the device under test and the ground connections on the probes.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: June 29, 1993
    Assignee: Tektronix, Inc.
    Inventors: Monty Smith, Garry P. Liddell, James E. Trimble, David G. Payne