Abstract: A high-speed, low-profile logic analyzer test probe has a body of insulating material molded directly onto a narrow elongate substrate having electrical circuitry disposed thereon. The molded insulating material has a notch formed therein for exposing a conductive surface formed on the substrate. The exposed conductive surface is used for making a ground connection between the substrate and the ground of a device under test. The probe may be adapted for use in probe holder for multichannel probing wherein the probe holder has an electrically conductive chip disposed within the probe holder housing for providing the shortest possible ground connections between the ground pins on the device under test and the ground connections on the probes.