Abstract: A method is provided for producing a ceramic substrate with at least one surface having sufficient smoothness to allow for placement of fine line electrical circuitry. A ceramic powder is placed in a die. A ceramic tape is formed having one surface with a desired degree of smoothness. A portion of the tape is placed into the die with the surface opposite the smooth surface in contact with the ceramic powder. The powder and tape are dry pressed to form an integral ceramic green body with a smooth surface. The green body can be sintered to form a sintered smooth-surfaced ceramic substrate. The smooth-faced ceramic substrate can be formed with the smooth face countersunk or with edges pulled back. A ceramic substrate can be formed with a conductive material between the cast tape layer and the base layer. A ceramic tape cast on a smooth carrier such as polyvinyl butyral and a method for producing such cast tape is also disclosed.