Abstract: An apparatus for and method of shaping interconnect leads which have been cut from an interconnect lead tape and have a semiconductor chip attached thereto. With a semiconductor chip attached to the interconnect leads of one section of an interconnect lead tape, and either during or after cutting of such leads from the remaining portion of the tape by means of a punch and matrix, a pressure differential is developed across the leads and chip to shape the leads to a desired and repeatable uniform configuration. While this pressure differential is applied, the free ends of the leads are held in one plane, such that the semiconductor chip is translated to a position which is spaced from the plane in which the free ends of the leads are held, thus bending the leads to conform to this change in position. This shaping can occur either before, during, or after the free ends of such interconnect leads are bonded to a lead frame.